Modified recovered cutting fluid

Abstract

The invention discloses a modified recovered cutting fluid, consisting of the following components in percentage by weight: 90-99.98% of recovered cutting fluid, 0.01-9% of extreme pressure resisting chelated anti-settling agent and 0.01-1% of nonionic surfactant. The modified recovered cutting fluid is prepared by adding function components into the recovered cutting fluid, which solves the problem of poor quality of the cutting pieces in the using process of the recovered fluid. The invention effectively solves the problems that the silicon wafers in the 100% recovered fluid is difficult to wash and dirty wafers are easy to generate and effectively reduces the surface damage of the silicon wafers so as to improve the yield of the cutting pieces. The modified recovered cutting fluid caneffectively reduce the cutting cost, turn the waste cutting fluid into useful products, reduce environment pollution and realize the reutilization of the resources.

Description

technical field [0001] The invention relates to the technical field of silicon chip cutting auxiliary materials, in particular to a modified recycled cutting fluid. Background technique [0002] As an inexhaustible clean energy source, the development and utilization of solar energy is attracting great attention never before. Commercial solar cells use non-toxic crystalline silicon. Monocrystalline and polycrystalline silicon cells are characterized by high photoelectric conversion efficiency, long life and good stability, but the cost is relatively high. With the continuous maturity and improvement of semiconductor manufacturing technology, the manufacturing cost of silicon wafers has been continuously reduced, but the cutting cost of silicon wafers used in solar cells has remained high, accounting for about 2% to 5% of the total manufacturing cost of solar cells. [0003] With the development of the solar silicon wafer cutting industry, it is inevitable to optimize the co...

AI Technical Summary

Problems solved by technology

[0005] First, the introduction and failure to remove undesirable impurities during the cutting and recycling process;

[0006] Second, the loss of functional components during cutting and recycling;

[0008] Therefore, the use of recovery liquid with poor recovery quality will not effectively control the contamination of chips in the next cutting application, and there will be more line marks, which will affect the yield of silicon wafers.

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