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Thermal pressing bonding device

A technology of crimping tool and receiving table, which is used in optics, instruments, electrical components, etc.

Inactive Publication Date: 2013-07-10
HITACHI HIGH-TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this method, although the pressure tool does not become high temperature, it can be expected to reduce the influence on the driving part of the pressure mechanism. The pressing part 19 is adjacent to each other, so that the heat of the anisotropic conductive film 7 is quickly taken away by the pressing part 19, resulting in a decrease in the temperature of the anisotropic conductive film 7, which instead leads to a longer heat curing treatment time.

Method used

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no. 1 Embodiment approach

[0021] First, refer to figure 1 A first embodiment of the thermocompression bonding apparatus of the present invention will be described.

[0022] figure 1 It is a perspective view showing the first embodiment of the thermocompression bonding apparatus of the present invention.

[0023] The thermocompression bonding device 1 includes a support 2 , a receiving table 3 provided at the middle portion of the support 2 in the vertical direction Z, and a thermocompression bonding unit 4 provided at the upper end of the support 2 . A rail receiving portion 5 is provided at the lower portion of the pillar 2 . The rail receiving portion 5 is slidably engaged with a rail 7 disposed below the pillar 2 . Accordingly, the thermocompression bonding device 1 is prohibited from moving in the depth direction Y, and can only move in the width direction X along the rail 7 . In addition, in figure 1 Among them, six movable thermocompression bonding devices 1 are arranged on rails 7 .

[...

no. 2 Embodiment approach

[0053] Below, refer to image 3 A second embodiment of the thermocompression bonding apparatus of the present invention will be described.

[0054] image 3 It is a perspective view showing the second embodiment of the thermocompression bonding apparatus of the present invention.

[0055] The thermocompression bonding device 51 has the same configuration as the thermocompression bonding device 1 of the first embodiment (see figure 1 ) with the same structure. The only difference between the thermocompression bonding device 51 and the thermocompression bonding device 1 is the heat sink 54 of the thermocompression bonding unit 52 . Therefore, the heat sink 54 will be described here, and the same reference numerals will be assigned to the same parts as those of the thermocompression bonding device 1 , and redundant description will be omitted.

[0056] The heat sink 54 is made of a material with high thermal conductivity such as aluminum, copper, and stainless steel, and is ...

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Abstract

The invention provides a thermal pressing bonding device. Even if the set temperature of a heating tool for heating a pressing bonding tool is higher than the past, the thermal pressing bonding device can prevent or inhibit damage of a driving part due to heat. The thermal pressing bonding device (1) comprises a bearing table (3), a pressing bonding tool (11), a heater (12), a cylinder (13) and aradiating fin (14). The pressing bonding tool (11) is heated by using the heater (12), and presses a driving IC circuit (102) on a display panel (101) between the pressing bonding tool (11) and the bearing table (3). The cylinder (13) is provided with a rod (21) connected with the pressing bonding tool (11) and a driving part (22) for driving the rod (21) to move so that the pressing bonding tool(11) is close to or far from the bearing table (3). The radiating fin (14) is arranged on the rod and positioned between the rod (21) and the pressing bonding tool (11).

Description

technical field [0001] The present invention relates to a thermocompression bonding device used, for example, when mounting a driver IC circuit on a display panel by a TAB mounting method. Background technique [0002] As a technology for electrically connecting drive IC circuits such as TCP (Tape Carrier Package) to a display panel such as a liquid crystal display, the TAB (Tape Automated Bonding) mounting method is widely used. In this TAB mounting method, for example, an ACF (Anisotropic Conductive Film: Anisotropic Conductive Film) is interposed between the display panel and the driver IC circuit, and the two are connected by thermocompression bonding. [0003] In recent years, the production volume of display panels has increased, productivity has improved, and operations have been accelerated. For example, in the thermocompression bonding process of the display panel and the driver IC circuit, the heating temperature of the pressure bonding tool is set higher than con...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13
CPCH01L2924/0002
Inventor 松谷昭弘大录范行
Owner HITACHI HIGH-TECH CORP