Electronic component inspecting method and apparatus used in the method

Abstract

Provided is an excellent inspecting method for quickly and correctly inspecting fine sections of an electronic component. An apparatus used in such method is also provided. An electronic component is placed on a stage, and an imaging means (40) provided by combining a differential interference microscope (44) and a CCD camera (45) is aligned by being moved by an X-direction moving means (46). As for an electronic component to be inspected first, an objective lens of the differential interference microscope (44) is advanced / retracted by means of a Z-direction adjusting means (47), and a plurality of images are continuously picked up. Then, an optimum focal point distance is calculated from the image data to perform focusing, then, an image is picked up. As for the subsequent electronic components, an image is picked up after performing automatic focusing, corresponding to a predicted optimum focal point distance derived from the optimum foal point distance stored in previous inspection or before, and whether the imaged portion is acceptable or not is inspected, based on the obtained image data.

Description

technical field [0001] The present invention relates to a method for inspecting microscopic defects and presence or absence of foreign matter of various electronic components and an apparatus used in the method. Background technique [0002] In recent years, in electronic components such as liquid crystal displays (LCDs), optical devices, and semiconductor devices, there has been a rapid development in the sophistication and refinement of mounting technology along with the increase in processing capacity and high integration. Therefore, on the production line of such high-density mounted electronic components, it is becoming more and more important to quickly and accurately inspect whether patterning of circuits, connections between members are appropriate, or whether foreign matter is mixed. [0003] For example, an LCD module can be obtained by mounting a driving chip on the edge of a glass substrate of a liquid crystal panel in a COG manner, and connecting the driving chi...

AI Technical Summary

Problems solved by technology

However, the conventional autofocus function uses reflected light from the subject to measure the distance to calculate the focal length. Therefore, it is difficult to accurately measure the distance from the microscope to the uneven surface of fine electronic components, and the distance from the back side of the transparent substrate to the distance that can be seen through the transparent substrate. Questions like the distance to the indentation

Therefore, recently, an autofocus function using a special laser-type displacement sensor or the like has been proposed as a technology to respond to the above-mentioned problems, but these technologies are expensive and require a lot of effort to adjust, so there is a problem that they cannot be widely used

In addition, if the focal length is calculated every time a subject is photographed, there is a problem that the speed of inspection is limited.

Moreover, when such a displacement sensor is installed in a microscope, there is also a problem that the overall weight of the microscope becomes heavy

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