Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor device test system, test handler, and test head, interface block for semiconductor device tester, method for classifying tested semiconductor device and method for supporting semiconductor device test

A component testing and semiconductor technology, applied in the direction of semiconductor/solid-state device testing/measurement, single semiconductor device testing, etc., can solve problems such as failures, and achieve the effect of preventing test errors, accurate testing, and ensuring reliability

Active Publication Date: 2013-09-04
TECHWING CO LTD
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the operating temperature of the test chip exceeds 60°C, it may cause malfunction
Therefore, testing of semiconductor components cannot be reliably performed at high temperatures

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor device test system, test handler, and test head, interface block for semiconductor device tester, method for classifying tested semiconductor device and method for supporting semiconductor device test
  • Semiconductor device test system, test handler, and test head, interface block for semiconductor device tester, method for classifying tested semiconductor device and method for supporting semiconductor device test
  • Semiconductor device test system, test handler, and test head, interface block for semiconductor device tester, method for classifying tested semiconductor device and method for supporting semiconductor device test

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0150] The closed space S can be notified of overheating through the test processor. Here, the notification method may be to generate an audible alarm or display it visually through the display of the test processor.

example 2

[0152] The work of the test processor can be temporarily stopped. Preferably, after the temperature of the enclosed space S returns to the required temperature range, the stop of the test processor is automatically released.

example 3

[0154] The semiconductor components tested when overheating occurs in the enclosed space S are classified by retest batches.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A semiconductor device test system and a test handler are disclosed. A temperature control apparatus is installed to an interface block of a test head and removes heat generated from a testing board. Therefore, the testing of semiconductor devices can be performed with a high degree of reliability.

Description

Technical field [0001] The present invention relates to a semiconductor element testing system and a test processor, and more particularly to a technology in which the interface block of a test head for testing semiconductor elements is provided with a test board for performing testing of semiconductor elements. Background technique [0002] Generally speaking, a semiconductor component test system includes: a test control device; a test head for testing semiconductor components under the control of the test control device; a test processor that provides a plurality of semiconductor components to the test head and makes The semiconductor element can be electrically connected to the test head to allow multiple semiconductor elements to be tested at the same time; the supporting device supports the test head so that the test head can be stably connected to the test processor. This supporting device is also called a "controller" in the technical field of the present invention. [000...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/26H01L21/66
Inventor 罗闰成具泰兴金昌来柳晛准
Owner TECHWING CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products