Computer cooling system

Abstract

The invention provides a computer cooling system which comprises a heat transferring unit, an integrated cooling unit and an external cooling unit. The heat transferring unit is connected with a heating part in a computer and transfers the heat of the heating part to the integrated cooling unit which is connected with the heat transferring unit through a heat-conducting part, cooling parts connected with the heat-conducting part are arranged in the integrated cooling unit and exchange heat with the heat-conducting part, and the external cooling unit is connected with the integrated cooling unit and transfers heat in the cooling part to the outside of the computer. In the invention, the heat transferring unit, the integrated cooling unit and the external cooling unit are independently arranged to avoid that the heating part is respectively cooled and are arranged in partitions so as to be convenient to lay out and have high centralized cooling efficiency; and the work of the heating part and other electronic parts are not influenced by adopting a centralized cooling mode, the computer safety is improved and the pollution can be reduced and the environment is protected by independently arranging the external cooling unit.

Description

technical field [0001] The invention relates to a computer cooling system. Background technique [0002] Since the birth of computer technology, people have been striving for computer systems with higher computing power, and computer technology has continuously made breakthroughs in high-speed computing and mass storage. At the same time, the power consumption of chips used for computing, processing, and storage is also increasing; especially from the perspective of structural design, the system is required to be small in size and novel in shape, which has become the pressure of heat dissipation technology. Taking computer CPU processors as an example, in the past few decades, from Celeron, Pentium to Core, although the manufacturing process has also been upgraded from 0.35μm to within 45nm, it still cannot restrain its power consumption from increasing from 10-30W to 130W, or even more. Big. Other chips such as South Bridge, North Bridge, and graphics cards have also doub...

AI Technical Summary

Problems solved by technology

Among them, the air blowing on key parts is characterized by obvious convection effect and obvious heat dissipation effect of key heating parts, but the hot air flow will still exist in the system, which will have a thermal impact on other electronic components, making other electronic components easy to age and malfunctions that threaten the security of the computer

In addition, during the convection heat dissipation process of the fan, sometimes the air flow that escapes may easily cause eddy currents or return to the fan air inlet, seriously affecting its heat dissipation capability, thereby threatening the safety of the computer with heat-generating components.

Finally, the convection heat dissipation of the fan is noisy and easy to cause dust

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