Computer cooling system

A heat dissipation system and computer technology, applied in computing, instrumentation, electrical digital data processing, etc., can solve problems such as eddy current or returning to the fan, threatening the safety of heating components, and easy aging of electronic components, so as to facilitate layout and concentration High heat dissipation efficiency, improved heat dissipation safety and reliability

Inactive Publication Date: 2011-02-16
INSPUR BEIJING ELECTRONICS INFORMATION IND
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Among them, the air blowing on key parts is characterized by obvious convection effect and obvious heat dissipation effect of key heating parts, but the hot air flow will still exist in the system, which will have a thermal impact on other electronic components, making other electronic components easy to age and malfunctions that threaten the security of the computer
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  • Computer cooling system
  • Computer cooling system

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Example Embodiment

[0022] Such as figure 1 As shown, the present invention includes a heat conduction unit 1, a centralized heat dissipation unit 2 and an external cooling unit 3. The heat transfer unit 1 is used to transfer the heat of the heating components 41 in the computer 4 to the centralized heat dissipation unit 2, the centralized heat dissipation unit 2 is used for centralized heat dissipation, and the external cooling unit 3 provides continuous power for the centralized heat dissipation unit 2. The heat conduction unit 1, the centralized heat dissipation unit 2 and the external cooling unit 3 are all connected to each other and arranged independently, which facilitates layout and eliminates mutual influence.

[0023] In the heat conduction unit 1, a heat pipe 11 is used as a heat conduction component. One end of the heat pipe 11 is connected to the heating components 41 in the computer 4, and the other end is connected to the heat conducting member 21 in the centralized heat dissipation u...

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Abstract

The invention provides a computer cooling system which comprises a heat transferring unit, an integrated cooling unit and an external cooling unit. The heat transferring unit is connected with a heating part in a computer and transfers the heat of the heating part to the integrated cooling unit which is connected with the heat transferring unit through a heat-conducting part, cooling parts connected with the heat-conducting part are arranged in the integrated cooling unit and exchange heat with the heat-conducting part, and the external cooling unit is connected with the integrated cooling unit and transfers heat in the cooling part to the outside of the computer. In the invention, the heat transferring unit, the integrated cooling unit and the external cooling unit are independently arranged to avoid that the heating part is respectively cooled and are arranged in partitions so as to be convenient to lay out and have high centralized cooling efficiency; and the work of the heating part and other electronic parts are not influenced by adopting a centralized cooling mode, the computer safety is improved and the pollution can be reduced and the environment is protected by independently arranging the external cooling unit.

Description

technical field [0001] The invention relates to a computer cooling system. Background technique [0002] Since the birth of computer technology, people have been striving for computer systems with higher computing power, and computer technology has continuously made breakthroughs in high-speed computing and mass storage. At the same time, the power consumption of chips used for computing, processing, and storage is also increasing; especially from the perspective of structural design, the system is required to be small in size and novel in shape, which has become the pressure of heat dissipation technology. Taking computer CPU processors as an example, in the past few decades, from Celeron, Pentium to Core, although the manufacturing process has also been upgraded from 0.35μm to within 45nm, it still cannot restrain its power consumption from increasing from 10-30W to 130W, or even more. Big. Other chips such as South Bridge, North Bridge, and graphics cards have also doub...

Claims

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Application Information

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IPC IPC(8): G06F1/20
Inventor 刘广志
Owner INSPUR BEIJING ELECTRONICS INFORMATION IND
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