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Inductor with patterned ground plane

A ground plane, patterned technology, applied in the field of inductors, can solve the problem of difficult to obtain high Q

Inactive Publication Date: 2011-03-02
QUALCOMM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it may be difficult to obtain a high Q due to various types of losses as described below
This may be especially true at the high frequencies used by many wireless communication systems

Method used

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  • Inductor with patterned ground plane
  • Inductor with patterned ground plane
  • Inductor with patterned ground plane

Examples

Experimental program
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Embodiment Construction

[0017] figure 1 A schematic diagram showing the design of the VCO 100 . In this design, VCO 100 includes an amplifier (AMP) 110 and a resonator tank circuit 120 consisting of an inductor 130 and a variable capacitor (varicap) 140 . Amplifier 110 provides the signal gain required for oscillation. Amplifier 110 and resonator tank circuit 120 together provide the 360° phase shift required for oscillation. VCO 100 provides a frequency f osc oscillator signal (Osc). Oscillation frequency f osc It is mainly determined by the inductance of the inductor 130 and the capacitance of the varactor diode 140 . All components of VCO 100, including inductor 130, can be fabricated on the RFIC for various benefits such as smaller size, lower cost, and improved reliability.

[0018] figure 2 A top view of an on-chip inductor 200 that can be implemented on an RFIC is shown. Inductor 200 can be used for figure 1 Inductor 130 in . The inductor 200 includes a 1-turn conductor 210 having a...

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Abstract

An inductor with patterned ground plane is described. In one design, the inductor includes a conductor formed on a first layer and a patterned ground plane formed on a second layer under the conductor. The patterned ground plane has an open center area and a shape matching the shape of the conductor. The patterned ground plane includes multiple shields, e.g., eight shields for eight sides of an octagonal shape conductor. Each shield has multiple slots formed perpendicular to the conductor. Partitioning the patterned ground plane into separate shields and forming slots on each shield help prevent the flow of eddy current on the patterned ground plane, which may improve the Q of the inductor. Multiple interconnects couple the multiple shields to circuit ground, which may be located at the center of the conductor.

Description

technical field [0001] The present invention relates generally to electronic devices, and more particularly to an inductor for an integrated circuit (IC) or printed circuit board (PCB). Background technique [0002] With modern advances in IC process technology, it is possible to manufacture radio frequency ICs (RFICs) for various applications such as wireless communications, networking, computing, and the like. These RFICs may include analog circuit blocks that were previously implemented with bulky discrete circuit components. Certain benefits such as smaller size, lower cost, and improved reliability can be realized by implementing analog circuit blocks on the RFIC. [0003] Many analog circuit blocks utilize inductors to perform desired functions and / or achieve desired performance. For example, filters, resonator tank circuits, and impedance matching networks may include inductors to obtain the desired circuit response. For some applications, such as resonator tank ci...

Claims

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Application Information

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IPC IPC(8): H01L23/522
CPCH01L2924/3011H01F2017/008H01F17/0006H01L23/5227H01L23/5225H01L2924/0002H01L2924/00
Inventor 靳彰
Owner QUALCOMM INC
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