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Method for predicting fatigue life of lead-free solder joint in electronic packaging

A fatigue life prediction and electronic packaging technology, which is applied in the fields of electrical digital data processing, special data processing applications, instruments, etc., can solve the problem of unreasonable data processing methods, insufficient data of thermophysical properties of lead-free materials, and affect the accuracy of life prediction and other issues to achieve the effect of shortening the development cycle, saving experiment costs and time, and improving accuracy and reliability

Inactive Publication Date: 2011-03-09
BEIJING UNIV OF TECH
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Problems solved by technology

However, there are still many deficiencies when using the finite element numerical simulation method to analyze the reliability of lead-free solder joints and the life of solder joints. It is inevitable to use model assumptions, insufficient data on the thermophysical properties of lead-free materials, and data during finite element calculations. Unreasonable processing methods, etc., will definitely affect the accuracy of life prediction

Method used

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  • Method for predicting fatigue life of lead-free solder joint in electronic packaging
  • Method for predicting fatigue life of lead-free solder joint in electronic packaging
  • Method for predicting fatigue life of lead-free solder joint in electronic packaging

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Embodiment Construction

[0037] A method for predicting the fatigue life of lead-free solder joints in electronic packages of the invention is used to predict the life of PBGA assembly lead-free solder joints.

[0038] The specific research object is the solder joints of 11×11-PBGA packaged devices with solder balls arranged in a full array. figure 1 Shown is a 1 / 4 solid model of a PBGA packaged device.

[0039] In step (1), the performance parameters of the materials of each part of the electronic packaging device are obtained, and the constitutive model of the solder joint is determined;

[0040] The performance parameters of the materials of each part of the PBGA electronic packaging device studied in this example are obtained by consulting published literature, reports, etc., and the performance parameters of each part of the materials are shown in Table 1 and Table 2.

[0041]

[0042] Table 1 Material parameters of PBGA devices

[0043] temperature / ℃

-40

25

50

...

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Abstract

The invention discloses a method for predicting the fatigue life of a lead-free solder joint in electronic packaging, which belongs to the technology of materials science and engineering application. How to effectively predict the service life of the lead-free solder joints of an electronic packaging structure attracts great attention of enterprises. The method for predicting the fatigue life of the lead-free solder joint in electronic packaging comprises the following steps: (1) obtaining the performance parameter of the material of each part of an electronic packaging device, and determining a constitutive model of the solder joint; (2) establishing a three-dimensional finite element model according to the researched structure of the electronic packaging device, and adding boundary conditions and corresponding loads according to the actual service conditions to perform value analogue analysis; and (3) analyzing the solder joint reliability and predicting the service life. The invention has the advantages of reasonably considering the coupling effect of plastic strain and creep strain generated by the same mechanism, thus greatly improving the precision and reliability of the service life prediction result, while ensuring simple prediction method and shortening the product development period.

Description

technical field [0001] The invention belongs to material science and engineering application technology, in particular to a method for predicting the fatigue life of lead-free solder joints in electronic packages. Background technique [0002] During the transition to lead-free, one of the most prominent issues brought about by changes in packaging materials and processes is the reliability of lead-free solder joints. In general, the research on the damage behavior and life of solder joints has been based on many years. Many life prediction methods have been adopted by different researchers. There are also many literatures on the research on SnPb solder joint fatigue models and life prediction methods. . At present, although there have been many reports at home and abroad on the development of lead-free solders, soldering processes and solder joint reliability, can the laws used to describe the damage and life of SnPb solder joints be directly applied to SnAgCu-based lead-f...

Claims

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Application Information

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IPC IPC(8): G06F17/50
Inventor 李晓延肖慧严永长刘娜史耀武郭福
Owner BEIJING UNIV OF TECH
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