Light emitting diode (LED) lamp with heat dissipation circuit board

Abstract

The invention discloses a light emitting diode (LED) lamp with a heat dissipation circuit board, which comprises a circuit board and an LED light emitting unit which is electrically connected on the circuit board, wherein the circuit board is a double-layer copper foil board; an insulating layer is integrally formed between the upper and lower copper foil layers; the circuit board is provided with a through hole; a heat conduction material is arranged in the through hole to form a heat conduction column; the upper and lower copper foil layers are communicated with each other by the heat conduction column; and heat, which is formed by the LED light emitting unit arranged on the upper copper foil layer, is evenly transferred to the upper and lower copper foil layers through the heat conduction column, thereby effectively radiating heat through the upper and lower copper foil layers. Therefore, the lamp has simple design structure, and the heat dissipation circuit board adopted in the invention can be freely provided with LED light emitting units with different powers according to the power of the lamp in actual demands, so that heat inside the LED lamp can be effectively radiated, thereby prolonging the service life of the lamp and effectively preventing light attenuation of the lamp.

Description

technical field [0001] The invention relates to an LED lamp, in particular to an LED lamp with a heat dissipation circuit board. Background technique [0002] Traditional LED light-emitting units are mostly low-power, based on the luminous efficiency and rich colors of LED chips, and the environmental pollution hazards of mercury metal in traditional fluorescent tubes, the demand for high-power LED light-emitting units in the fields of general lighting and decorative lighting Use more and more intensely. [0003] The heat dissipation of high-power LED light-emitting units has always hindered its wide application, mainly due to the inability to dissipate heat well, which reduces the life of the LED light-emitting unit and makes its light decay more serious. Chinese patent application number 200310118374.5 discloses a high thermal conductivity PCB type surface mount light-emitting diode, which mainly uses a heat-conducting metal body and an LED chip to be packaged together, s...

AI Technical Summary

Problems solved by technology

However, the LED light-emitting unit mainly dissipates heat by setting a heat sink at its bottom. This method makes the volume of the high-power LED light-emitting unit larger, and the overall structure of the LED lamp designed in this way is larger. The contact area between the unit and the heat sink is small, and the use of a large-volume heat sink cannot effectively reduce the junction temperature of the LED chip, which in turn affects the service life of the LED light-emitting unit

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