Electronic device and manufacturing method thereof
A technology for electronic devices and manufacturing methods, which is applied in the manufacture of inductors/transformers/magnets, semiconductor/solid-state devices, circuits, etc., can solve the problems of difficult process operation, high cost, and reduced capacitance value density, and achieve higher capacitance value. Effects of Density and Quality Factor
Active Publication Date: 2013-02-27
XINTEC INC
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Problems solved by technology
[0003] Traditional capacitors and inductors can also be fabricated on chip-packaged printed circuit boards (PCBs), which usually use polymer as the dielectric layer material of the capacitor, so that the capacitor can achieve a high quality factor, but its capacitance value density is therefore and reduce
Although high dielectric constant (high K) polymers can be used as dielectric layer materials to increase capacitance density, high dielectric constant polymer materials are expensive and difficult to operate in the manufacturing process
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[0039] In order to make the above-mentioned purpose, features and advantages of the present invention more comprehensible, a detailed description is given below in conjunction with the accompanying drawings.
[0040] This embodiment provides an electronic device using a semiconductor substrate and a glass substrate to manufacture passive components and a manufacturing method thereof, which can separately manufacture an inductor or separately form a metal-insulator-metal (metal-insulator-metal, MIM for short) capacitor, In this embodiment, an inductor-capacitor integrated passive device (inductor-capacitor integrated passive device, referred to as L-C IPD) containing this capacitor can also be produced, so the following embodiments show both the inductor region and the capacitor region for convenience of description, but the It is not limited to simultaneous production. The structure of this embodiment can have a higher capacitance value density or a higher quality factor. How...
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Abstract
The invention provides an electronic device and a manufacturing method thereof. The electronic device comprises a glass substrate, a patterned semiconductor substrate, and at least one passive component, wherein the patterned semiconductor substrate is provided with at least one opening arranged on the glass substrate; the at least one passive component comprises a first conductive layer and a second conductive layer; and the first conductive layer is arranged between the patterned semiconductor substrate and the glass substrate. According to the invention, capacitance density and quality factor can be increased, and the capacitor and inductor regions can be flattened.
Description
technical field [0001] The present invention relates to an electronic device, in particular to a passive element of inductance and / or capacitance and a manufacturing method thereof. Background technique [0002] Generally speaking, some passive components, such as resistors, capacitors or inductors, are arranged around the active components of the chip to store or release electric energy in the circuit to adjust the stability of the current. A capacitor consists of two electrodes with a dielectric layer between them, while an inductor is usually a helical inductor. [0003] Traditional capacitors and inductors can also be fabricated on chip-packaged printed circuit boards (PCBs), which usually use polymer as the dielectric layer material of the capacitor, so that the capacitor can achieve a high quality factor, but its capacitance value density is therefore And lower. Although a high dielectric constant (high K) polymer can be used as a dielectric layer material to increas...
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IPC IPC(8): H01L27/01H01F37/00H01G4/00H01G4/40H01L21/77H01F41/00
Inventor 倪庆羽
Owner XINTEC INC