Method for testing contact thermal resistance of GH4169/K417 alloy

Abstract

The invention discloses a method for testing the contact thermal resistance of a GH4169 / K417 alloy. The method comprises the following steps: first, confirming the reduced elastic moduli of two contact materials, and then modeling according to the plastic deformation theory of metal materials; simplifying models; confirming unknown parameters bo, b1, b2 and b3 through stepwise regression experiments, and obtaining an optimal regression equation; obtaining the contact thermal conduction of the GH4169 / K417 alloy through regression analysis results, calculating the reciprocal of the contact thermal conduction, and obtaining the contact thermal resistance. When temperature is within the interval of 100-600 DEG C and independent variables choose the temperature and pressure value, hs=26.534T0.107P1.297, and when the independent variables only choose the pressure value, hs=41.43P1.291. By using the invention, the contact thermal conduction can be obtained according to a simple formula under the condition of randomly changing testing temperature and pressure only after the needed parameters b0, b1 and b3 are obtained through experiment data, and the testing process of the contact thermal resistance is simple and can be repeatedly used. Under the premise of ensuring engineering practicability and the accuracy of testing results, the testing process of the contact thermal conduction is greatly simplified.

Description

technical field [0001] The invention belongs to the technical field of high-temperature metal material testing, and in particular relates to a contact thermal resistance testing method for GH4169 / K417 alloys. Background technique [0002] Many models, empirical and semi-empirical relations for predicting contact conductance have been proposed in the past few decades. The classic models include the Mikic elastic model, the CMY (Cooper, Mikic and Yovanovich) plastic model, and the elastic-plastic deformation model by Sridar and Yovanovich. The theoretical research in China is mainly reflected in the numerical simulation of contact thermal resistance. [0003] In the prior art, the contact thermal resistance test of two high-temperature materials is carried out through a large number of tests. The test process is to select the interface material and process it into a sample with a certain size and a certain interface roughness, and then pressurize and heat the interface. Prov...

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Problems solved by technology

[0004] Although the existing test technology can accurately obtain the contact heat conduction under the conditions of given temperature, pressure and interface roughness, due to the complexity of the test process and relatively fixed test conditions, it cannot meet the changing temperature and pressure conditions in engineering applications. Unable to provide timely and accurate contact thermal conductivity data at the material interface

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