Plate overhaul facility and overhaul method thereof

Abstract

The invention discloses a plate overhaul facility and an overhaul method thereof which are used for enhancing the yield of plate products. The plate overhaul facility comprises an overhaul workbench (1), an image acquisition device (2), at least one lighting device (3), an adsorption tube (4), a dust collector (5), a dust collection control valve (6) and a controller (7), wherein the overhaul workbench (1) is used for loading the plate; the image acquisition device (2) and the lighting device (3) are positioned above the overhaul workbench (1); the adsorption tube (4) is positioned above the overhaul workbench (1); the dust collection control valve (6) is connected between the adsorption tube (4) and the dust collector (5); and the controller (7) is connected with the dust collection control valve (6) in a wired or wireless mode to be used for controlling the opening or closing of the dust collection control valve (6), thereby removing the foreign matters on the plate and / or the overhaul workbench (1) through the adsorption tube (4) and the dust collector (5).

Description

technical field [0001] The invention relates to the field of printed circuit board production, in particular to board maintenance equipment and a maintenance method thereof. Background technique [0002] At present, after the production of printed circuit boards and high-density interconnection boards is completed, optical inspection is required to detect abnormal boards. Make up the line. At present, abnormal points are still repaired manually. see figure 1 , the maintenance equipment includes: the inspection worktable, the camera located above the inspection worktable, and two LED table lights. The camera and the light can be fixed together and move in the set track space, that is, the camera and the light are synchronized. Move so that each abnormal point of the board can be carefully inspected. The maintenance process includes: put the board on the maintenance workbench, turn on the LED table lighting, control the camera to move it above the abnormal point of the boa...

AI Technical Summary

Problems solved by technology

[0003] However, a large amount of copper slag is often produced during the repair process. The existing method of removing copper slag is the wiping method, that is, manually wiping off the copper slag on the board surface

This method cannot effectively remove the copper slag, and the anti-sticking phenomenon will also occur, resulting in a new short circuit abnormality (Shot), resulting in a decrease in the yield rate

[0004] It can be seen that the current panel maintenance equipment cannot improve the yield rate of panel products very well, and it is easy to reduce the yield rate of products due to poor cleaning effect

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