Electroplate jig
A technology of electroplating fixtures and plated holes, which is applied in the electrolysis process, electrolysis components, and the formation of electrical connections of printed components, etc. It can solve the problems of copper foil damage to the circuit board, circuit board distortion, and inconsistency, so as to alleviate the impact and avoid distortion. or cracking effect
Inactive Publication Date: 2012-07-04
AVARY HLDG (SHENZHEN) CO LTD +1
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- Description
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AI Technical Summary
Problems solved by technology
The commonly used jig is a square frame. When multiple screws are used to lock the circuit board to the jig, the degree to which the multiple screws are locked to the jig may be inconsistent. In the absence of reinforcement measures, the circuit board will be damaged. Distortion occurs, which will damage the copper foil of the circuit board in severe cases
In addition, the swing of the flying bar also causes the circuit board to be impacted by the electroplating solution. For a circuit board with a small thickness, especially a flexible circuit board with a small thickness, the adverse consequences of this impact are more obvious, and may even cause Distortion of the copper foil layer
Method used
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Embodiment Construction
[0010] The electroplating jig provided by the technical solution will be described in detail below with reference to the drawings and embodiments.
[0011] see figure 1 The embodiment of the technical solution provides an electroplating jig 10 for holding a circuit board having a plurality of holes to be plated to perform electroplating on the plurality of holes to be plated. The electroplating fixture 10 includes a hanger 11 , a first cover 12 , a second cover 13 , a sealing ring 14 and a plurality of fixing pieces 15 .
[0012] The hanger 11 includes at least one hook 110 , a frame 111 and a plurality of conductive elements 112 .
[0013] The hook 110 is used for connecting with an electroplating device (not shown). The electroplating device may include a power source, an electroplating bath, an anode, and a conductive flying bar. Both the anode and the conductive flying rod are arranged in the electroplating tank, and are respectively connected to the positive pole and t...
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Abstract
The invention relates to an electroplate jig which is used for firmly holding a circuit board with a plurality of holes to be plated and electroplating the holes to be plated. The electroplate jig comprises a hanging rack, a first cover plate, a second cover plate and a plurality of fixed parts, wherein the hanging rack comprises a frame body and a plurality of conducting pieces extending from the frame body; each conducting piece is provided with a first fixed hole; the circuit board is clamped between the first cover plate and the second cover plate; the first cover plate is positioned between the frame body and the second cover plate; the second cover plate is provided with a plurality of second fixed holes and a plurality of through holes; the second fixed holes and the first fixed holes are in one-to-one correspondence; the through holes are in one-to-one correspondence with the holes to be plated of the circuit board; and the fixed parts and the second fixed holes are in one-to-one correspondence, and the fixed parts are matched with the first fixed holes and the second fixed holes so as to fix the circuit board, thus current can be conducted from the frame body, the conducting pieces and the fixed parts to the circuit board so as to electroplate holes to be plated.
Description
technical field [0001] The invention relates to circuit board manufacturing technology, in particular to an electroplating jig which can avoid damage to the copper foil of the circuit board. Background technique [0002] With the development of electronic products in the direction of miniaturization and high speed, circuit boards are also developing from single-sided circuit boards and double-sided circuit boards to multi-layer circuit boards. Multilayer circuit board refers to a circuit board with multiple layers of conductive lines, which has more wiring area and higher interconnection density, so it is widely used, see literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi , H.Mukoh, A.Wajima, M.Res.Lab., High density multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992, 15(4):418-425. [0003] Making via holes is the main way to realize the electrical connection between the conductive layers of the multila...
Claims
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IPC IPC(8): C25D17/06C25D7/00H05K3/42
Inventor 郑建邦
Owner AVARY HLDG (SHENZHEN) CO LTD