BGA (ball grid array) coplanarity measuring system based on projection Moire principle

A measurement system and coplanarity technology, applied in measurement devices, instruments, optical devices, etc., can solve the problems of inability to adjust and affect the grating, and achieve the effect of good contrast, improved measurement accuracy, measurement accuracy and measurement speed.
CN102052907BActive Publication Date: 2012-05-23HUAZHONG UNIV OF SCI & TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HUAZHONG UNIV OF SCI & TECH
Publication Date
2012-05-23

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Abstract

The invention discloses a coplanarity measuring system based on the projection Moire principle, which comprises a cold light source (1), a collimating lens (3), CCD (charge coupled device) cameras (2, 4), an LCD (liquid crystal display) panel (5), a projection lens (6), an optical platform (7), a high-precision mobile station (8) and a computer (9), wherein the LCD panel (5) displays a strip pattern generated by the computer (9); the light emitted by the cold light source (1) is irradiated on the LCD panel (5) after passing through the collimating lens (3); the strip pattern displayed on the LCD panel (5) is projected to the surface of a reference plane or an object loaded to be measured on the high-precision mobile station (8); and two CCD cameras are symmetrically arranged at two sides of the LCD panel (5). The measuring area and the measuring precision of the coplanarity measuring system are increased, which can meet the demand of large-area, high-precision, quick and real-time measurement in current encapsulation test.
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Description

technical field

[0001] The invention belongs to the field of electronic packaging, and in particular relates to a coplanarity measurement system for packaged devices in electronic packaging, which is suitable for large-scale packaging such as BGA (Ball Grid Array, ball grid array packaging) and CSP (Chip Size Package, chip size packaging), etc. The coplanarity of large-scale integrated circuit packages is detected in real time. Background technique

[0002] The integrated circuit (IC) industry has become the key to the development of the national economy, and IC design, manufacturing and packaging testing are the three pillars of the IC industry development. In actual production, due to the lack of on-line and off-line evaluation methods, many products fail to discover hidden dangers in the reliability of the products before they are put into the market, and even can only detect their processing quality and reliability through the use process of the device, which seriously h...

Claims

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