BGA (ball grid array) coplanarity measuring system based on projection Moire principle
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HUAZHONG UNIV OF SCI & TECH
- Publication Date
- 2012-05-23
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Abstract
Description
technical field
[0001] The invention belongs to the field of electronic packaging, and in particular relates to a coplanarity measurement system for packaged devices in electronic packaging, which is suitable for large-scale packaging such as BGA (Ball Grid Array, ball grid array packaging) and CSP (Chip Size Package, chip size packaging), etc. The coplanarity of large-scale integrated circuit packages is detected in real time. Background technique
[0002] The integrated circuit (IC) industry has become the key to the development of the national economy, and IC design, manufacturing and packaging testing are the three pillars of the IC industry development. In actual production, due to the lack of on-line and off-line evaluation methods, many products fail to discover hidden dangers in the reliability of the products before they are put into the market, and even can only detect their processing quality and reliability through the use process of the device, which seriously h...