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Method for manufacturing multilayer printed circuit board (PCB)

A technology for printed circuit boards and manufacturing methods, applied in the direction of multi-layer circuit manufacturing, etc., can solve the problems of large inner layer copper thickness, unrestricted flow, poor uniformity of board thickness, etc., to improve product yield and reliability. Effect

Active Publication Date: 2013-07-03
NEW FOUNDER HLDG DEV LLC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] like figure 1 As shown, after the first layer of printed wiring composed of inner layer copper is made on the front and back sides of the insulating substrate, the resin layer is formed between the inner layer copper and the outer layer copper by using the existing method. Due to the characteristics of heat curing and the influence of high temperature in the lamination process, the flow of resin has a regional range and cannot flow without restriction. In addition, the thickness of the inner layer copper is relatively large, so it is inevitable to adopt the traditional lamination method. There will be poor thickness uniformity and the above-mentioned glue filling defects

Method used

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  • Method for manufacturing multilayer printed circuit board (PCB)
  • Method for manufacturing multilayer printed circuit board (PCB)
  • Method for manufacturing multilayer printed circuit board (PCB)

Examples

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Embodiment Construction

[0035] The invention provides a method for manufacturing a multilayer printed circuit board, which is characterized in that it comprises:

[0036] Coating a deformable form material between the metal parts constituting the inner printed circuit;

[0037] When it is determined that the filling thickness of the applied material reaches a set thickness, cover the prepreg on the metal part, and the set thickness does not exceed the thickness of the metal part constituting the inner printed circuit;

[0038] Covering the metal plate for making the outer printed circuit on the prepreg for pressing;

[0039] The metal plate is etched to complete the fabrication of the outer printed circuit.

[0040] Preferably, in each embodiment of the present invention, the deformable material can be semi-solid material, fluid material, liquid material or other deformable material, so that these materials can be filled in the required space . More preferably, these materials can be cured under s...

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Abstract

The invention discloses a method for manufacturing a multilayer printed circuit board (PCB). The method comprises the following steps: coating deformable materials among metal parts for forming inner-layer printed circuits; after confirming that the filling thickness of the coated materials reaches the set thickness, covering the metal parts with prepregs; covering the prepregs with metal boards for manufacturing outer-layer printed circuits and laminating the metal boards and the prepregs; and etching the metal boards to complete manufacturing of the outer-layer printed circuits. The method has the beneficial effects of solving the problems of thickness uniformity and resin filling among circuits after lamination of heavy copper boards and improving the product yield and reliability.

Description

technical field [0001] The invention relates to the technical field of manufacturing printed circuit boards, in particular to a method for manufacturing multilayer printed circuit boards. Background technique [0002] The printed circuit board (Printed Circuie Board, PCB) circuit production is to cover the copper layer on the insulating layer first, and then etch away the excess copper by etching to form the required circuit pattern. The PCB board is divided into a single-sided PCB board and a double-sided PCB board. The single-sided PCB refers to the printed circuit on one side of the insulating substrate, and the upper PCB refers to the printed circuit on both sides of the insulating substrate. [0003] Whether it is a single-sided PCB board or a double-sided PCB board, there may be multiple layers of printed circuits, and adjacent printed circuit layers are separated by insulating layers. Heavy copper printed circuit board (Heavy Copper PCB) refers to a multi-layer print...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
Inventor 唐国梁
Owner NEW FOUNDER HLDG DEV LLC
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