Liquid-cooling heat radiating device

Abstract

A liquid-cooling heat radiating device comprises a heat absorbing body, a heat radiating body and a driver, wherein the heat absorbing body, the heat radiating body and the driver are connected through a pipeline to form a loop; the loop is filled with cooling fluid; the driver drives the cooling fluid to flow circularly in the loop; the heat absorbing body comprises a heat absorbing plate, a radiator and a heat pipe; the interior of the heat absorbing body forms a cavity; the radiator and the heat pipe are accommodated in the cavity; and the heat absorbing plate is connected with the radiator through the heat pipe and used for being contacted with a heat source.

Description

technical field [0001] The invention relates to a liquid cooling heat dissipation device, in particular to a liquid cooling heat dissipation device suitable for heat dissipation of electronic components. Background technique [0002] With the rapid development of electronic technology, electronic components such as central processing units run faster and faster, and the heat generated during their operation also increases accordingly, seriously threatening the performance and stability of electronic components. In order to ensure the normal operation of electronic components, it is necessary to effectively dissipate heat from the electronic components. However, it is increasingly difficult for existing air-cooled heat dissipation devices to meet the heat dissipation requirements of high-frequency and high-speed electronic components. For this reason, liquid-cooled heat dissipation devices are gradually adopted by the industry. [0003] The liquid-cooled heat sink generally...

AI Technical Summary

Problems solved by technology

However, due to the limited contact area between the metal plate and the pipe, the ability of the heat absorbing part to transfer heat to the cooling liquid is limited, thereby limiting the overall heat dissipation performance of the liquid cooling heat sink

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