Liquid-cooling heat radiating device

A liquid-cooled heat dissipation and heat dissipation technology, which is applied in cooling/ventilation/heating transformation, indirect heat exchangers, lighting and heating equipment, etc. It can solve the problem of limited contact area between metal plates and pipes, which limits the overall heat dissipation performance of liquid-cooled heat sinks , limiting the ability to transfer heat, etc.

Inactive Publication Date: 2011-05-11
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the limited contact area between the metal plate and the pipe, the ability of the heat absorbing part to transfer heat to the cooling liquid is limited, thereby limiting the overall heat dissipation performance of the liquid cooling heat sink

Method used

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  • Liquid-cooling heat radiating device
  • Liquid-cooling heat radiating device
  • Liquid-cooling heat radiating device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] see figure 1 , the liquid cooling device 100 includes a heat absorber 10 , a heat sink 20 and a driver. The driver can be a pump 30 . The heat absorbing body 10 , the cooling body 20 and the pump 30 are sequentially connected to form a circuit through the pipeline 40 . This circuit is filled with cooling liquid.

[0013] Please also see figure 2 and image 3 , the heat absorbing body 10 includes a heat absorbing plate 12, a radiator 18 positioned above the heat absorbing plate 12, a heat pipe 16 connecting the heat absorbing plate 12 and the radiator 18, and a cover disposed on the heat absorbing plate 12 and A cover 14 sealingly connected with the heat absorbing plate 12 . The heat absorbing plate 12 is made of a metal material with good thermal conductivity, such as copper. The heat absorbing plate 12 is substantially flat and has a flat upper surface 122 . The lower surface 124 of the heat absorbing plate 12 protrudes downward to form a flat square contact su...

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PUM

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Abstract

A liquid-cooling heat radiating device comprises a heat absorbing body, a heat radiating body and a driver, wherein the heat absorbing body, the heat radiating body and the driver are connected through a pipeline to form a loop; the loop is filled with cooling fluid; the driver drives the cooling fluid to flow circularly in the loop; the heat absorbing body comprises a heat absorbing plate, a radiator and a heat pipe; the interior of the heat absorbing body forms a cavity; the radiator and the heat pipe are accommodated in the cavity; and the heat absorbing plate is connected with the radiator through the heat pipe and used for being contacted with a heat source.

Description

technical field [0001] The invention relates to a liquid cooling heat dissipation device, in particular to a liquid cooling heat dissipation device suitable for heat dissipation of electronic components. Background technique [0002] With the rapid development of electronic technology, electronic components such as central processing units run faster and faster, and the heat generated during their operation also increases accordingly, seriously threatening the performance and stability of electronic components. In order to ensure the normal operation of electronic components, it is necessary to effectively dissipate heat from the electronic components. However, it is increasingly difficult for existing air-cooled heat dissipation devices to meet the heat dissipation requirements of high-frequency and high-speed electronic components. For this reason, liquid-cooled heat dissipation devices are gradually adopted by the industry. [0003] The liquid-cooled heat sink generally...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/473
CPCG06F1/20G06F2200/201H01L23/3672H01L23/427H01L23/473H01L2924/0002F28D15/0275F28D15/0266H01L2924/00
Inventor 汤贤袖叶振兴
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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