Stack package assembly
A technology of packaging components and packages, which is applied in the direction of electrical components, electric solid-state devices, semiconductor devices, etc., can solve the problems of short circuit of wires, reduction of electrical performance of stacked packaging components, increase of inductance of adjacent wires, etc.
Active Publication Date: 2014-08-27
ADVANCED SEMICON ENG INC
View PDF10 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Lead misalignment, if not identified, may result in shorting of adjacent leads, increased inductance of adjacent leads, and other effects
This will cause the electrical performance of the stacked package components to decrease, and the corresponding packaging yield will decrease
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0035] The following definitions apply to some aspects of some embodiments according to the present invention. Definitions are likewise detailed here.
[0036] As used herein, the singular words "a", "an" and "the" include several referents, unless the context clearly dictates otherwise. Thus, for example, when referring to a conductive contact, such a conductive contact may include a plurality of conductive contacts, unless the context clearly indicates otherwise.
[0037] As used herein, the term "set" means a collection of one or more components. Thus, for example, a layer group may include a single layer or multiple layers. A set of components (components of a set) can also be interpreted as part of this group (members of the set). The components of a set can be the same or different. In some examples, components of a group may share one or more common characteristics.
[0038] As used herein, the word "adjacent" means adjacent or next to. Adjacent several components...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
An embodiment of a stacked package assembly includes a first semiconductor package, a second semiconductor package, a conductive bump, a second conductive contact, and a wire. The first semiconductor package includes a semiconductor device, a package body and a first conductive contact. The semiconductor device includes rear and side surfaces. The package body includes an upper surface and substantially covers the rear and side surfaces of the device. The first conductive contact piece is adjacent to the upper surface of the package body and is electrically connected to the device. The second semiconductor package is disposed on the upper surface of the package body. The conductive bump is adjacent to the first contact and the second package. The second conductive contacts are located outside the first and second packages. The wire is electrically connected to the first and second packages and the second contact member, a first end of the wire is adjacent to the first contact member, and at least part of the first end of the wire is covered by the bump.
Description
technical field [0001] The present invention relates to a semiconductor package and its manufacturing method, and more particularly to a stacked semiconductor package capable of reducing wire sweep and its manufacturing method. Background technique [0002] Electronic products are becoming more complex, at least in part, driven by increased functionality and reduced size. While the benefits of increased functionality and reduced size are obvious, achieving those benefits can also create problems. In particular, electronic products generally require accommodating high-density semiconductor components in a limited space. For example, in cell phones, personal digital assistants, laptop computers, and other portable consumer products, space for processors, storage devices, and other active or passive devices can be quite limited. Semiconductor components are generally packaged to provide protection from environmental conditions and to provide electrical connections for input a...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/00H01L23/48H01L23/482
CPCH01L2924/15311H01L2224/73257H01L2924/19107H01L24/73H01L2924/15331H01L25/03H01L2924/30107H01L2224/73207H01L24/24H01L2224/48091H01L24/19H01L2924/01029H01L2224/48227H01L24/48H01L2224/023H01L2224/04105H01L2224/12105H01L2224/16225H01L2924/00014H01L2924/181H01L2924/00012H01L2224/45099H01L2224/45015H01L2924/207H01L2924/0001
Inventor 陈家庆蔡裕斌
Owner ADVANCED SEMICON ENG INC