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Surface mount technology of ratio frequency power amplification mainboard

A radio frequency power amplifier and patch technology, which is applied in the field of patch technology of the radio frequency power amplifier motherboard, can solve the problems of heat dissipation and grounding performance degradation, and achieve the effects of reducing product cost, improving reliability and service life, and good heat dissipation and grounding performance

Active Publication Date: 2011-05-18
WUHAN GEWEI ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to enhance the heat dissipation effect of the power amplifier, the current industry mainly adopts direct soldering of components on the PCB, and then fixes the PCBA (Printed Circuit Board Assembly, PCB component) component on the heat dissipation bottom plate or cavity by locking screws, so that the final circuit and the power amplifier tube are directly locked on the bottom plate or the heat dissipation cavity by screws, and the heat dissipation and grounding are realized by screws, and the heat dissipation and grounding performance are greatly reduced

Method used

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  • Surface mount technology of ratio frequency power amplification mainboard
  • Surface mount technology of ratio frequency power amplification mainboard
  • Surface mount technology of ratio frequency power amplification mainboard

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Embodiment Construction

[0040] In order to facilitate a further understanding of the process and achieved effects of the present invention, preferred embodiments are described in detail below in conjunction with the accompanying drawings.

[0041] Such as figure 1 As shown, the patching process of a kind of radio frequency power amplifier motherboard of the present invention comprises the following steps:

[0042] Technology of the present invention is implemented according to the following steps:

[0043] S1: Design the stencil template. In the present invention, two stencils are required, namely the reverse stencil and the front stencil. The reverse stencil meets the requirement of brushing solder paste on the reverse side of the PCB, and the front stencil meets the requirements of brushing the aluminum plate and PCB with solder paste through tooling at the same time;

[0044] S2: Design printing tooling, pressing tooling and aluminum plate positioning tooling to meet the production of SMT;

[00...

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Abstract

The invention discloses a surface mount technology of a ratio frequency power amplification mainboard. The technology comprises the following steps of: designing a steel mesh template; designing a printing tool, a pressing tool and an aluminum sheet positioning tool so as to meet the requirement for surface mounted device production; roasting a power amplification tube and a PCB (Printed Circuit Board) according to a moist sensitivity control rule; printing solder paste on the back of the PCB; simultaneously printing the solder paste including solder paste required by welding the power amplification tube on the PCB and the aluminum sheet through a tool; carrying out surface mount on a surface mounted device through surface mount equipment, including the operation of mounting the amplification tube; inserting a THT (Through Hole Technology) connector assembly by hands on the PCB mounted with the device; loading the PCB and the aluminum sheet into the tool; and treating the PCB and the aluminum sheet in a backflow furnace. The surface mount technology of the ratio frequency power amplification mainboard guarantees good power amplification ratio frequency heat dissipation and grounding property and greatly improves the reliability and the service life of the power amplification; meanwhile, because aluminum sheet welding is adopted and a nickel plating process is used for treating the surface of the aluminum sheet, the product cost is reduced.

Description

technical field [0001] The invention relates to a patching process for a radio frequency power amplifier mainboard, in particular to a chipping process for a radio frequency power amplifier mainboard with good heat dissipation effect and low manufacturing cost. Background technique [0002] RF power amplifiers are developing in the direction of high power and low cost. As the output power required by RF power amplifiers increases, its heat dissipation design is particularly important, because the heat dissipation effect of power amplifiers directly affects the reliability of power amplifiers. stability, and its performance indicators. In order to enhance the heat dissipation effect of the power amplifier, the current industry mainly adopts direct soldering of components on the PCB, and then fixes the PCBA (Printed Circuit Board Assembly, PCB component) component on the heat dissipation bottom plate or cavity by locking screws, so that the final circuit And the power amplifi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
Inventor 孟庆南
Owner WUHAN GEWEI ELECTRONICS TECH
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