Apparatus for coupling a module circuit board and a frame together, and backlight using same

A circuit substrate and combination device technology, applied in the directions of light guides, optics, optical components, etc., can solve the problems such as difficulty in reducing the thickness of the backlight device display, inability to achieve productivity improvement, and labor-consuming work hours, so as to reduce operating hours and improve reliability. The effect of improving the bonding force

Inactive Publication Date: 2011-05-18
LPOINT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Fixing the light-emitting diode module and the frame with the above-mentioned fixing screws is relatively poor in combination, and consumes a lot of man-hours, so that the productivity cannot be improved.
[0012] Also, in the case of the light emitting diode module, since the light emitting diodes generate a lot of heat as described above, other heat dissipation parts for cooling them are required, and the heat dissipation parts become difficult to reduce the thickness of the backlight device and the thickness of the display. The main reason

Method used

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  • Apparatus for coupling a module circuit board and a frame together, and backlight using same
  • Apparatus for coupling a module circuit board and a frame together, and backlight using same
  • Apparatus for coupling a module circuit board and a frame together, and backlight using same

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Embodiment Construction

[0057] Hereinafter, embodiments of the present invention will be specifically described based on the drawings.

[0058] The backlight device of the present invention can be used as a light source in a liquid crystal display, and has a combination structure of a module circuit substrate and a frame, wherein, on the module circuit substrate, a plurality of light emitting diodes are arranged according to a predetermined pattern or surface mounted . figure 1 and figure 2 Embodiments of the backlight device of the present invention are shown.

[0059] Referring to the same drawing, the backlight device 10 using a combination device that combines a module circuit substrate provided with light emitting diodes on a frame includes a frame 20, a module circuit substrate 40, and a light guide plate unit 110, and the frame 20 is used to hold a liquid crystal display panel; The module circuit substrate 40 is combined with the frame 20 through the combination unit 30, and is provided wit...

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Abstract

The present invention provides an apparatus for coupling a module circuit board and a frame together, and backlight using the same, wherein a coupling structure of the module circuit board equipped with light-emitting diodes and the frame is improved. The apparatus comprises: a module circuit board on which light-emitting diodes are arranged into a predetermined pattern; and a frame coupled to the module circuit board by a coupling unit, wherein the coupling unit has coupling grooves formed at the back surface of the module circuit board, and coupling members formed at the frame to be coupled to the respective coupling grooves.

Description

technical field [0001] The present invention relates to a backlight device, in particular, to a combination device of a module circuit substrate and a frame with an improved combination structure of a module circuit substrate and a frame, and a backlight device using the combination device, wherein the module circuit substrate is provided with a light-emitting device. diode. Background technique [0002] Due to the rapid development of semiconductor technology, the demand for flat panel display devices with further improved image resolution, brightness, contrast, etc. is growing explosively along with miniaturization and weight reduction of flat panel display devices. [0003] Among the flat panel display devices, liquid crystal displays (LCD: liquid crystal displays), plasma displays, organic EL displays, and LED displays, which have attracted attention in recent years, have advantages such as flat panelization and low power consumption, and are thus capable of overcoming e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/1333G02F1/1345
CPCG02B6/0085G02B6/009G02F1/1333G02F1/1345
Inventor 李钟垠
Owner LPOINT
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