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Radiating structure for electromagnetic oven

A heat dissipation structure and technology of an induction cooker, applied in the field of small kitchen appliances, can solve the problems of affecting the work of the induction cooker, poor heat dissipation effect of the bridge stack, inability to realize the industrial design of ultra-thin products, etc., and achieve the effect of high heat dissipation efficiency

Active Publication Date: 2011-05-25
ZHEJIANG SUPOR ELECTRICAL APPLIANCES MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the IGBT and the bridge stack are vertically attached to the side of the heat sink, the ultra-thin industrial design of the product cannot be realized, and the wind direction of the fan depends on the guide surface set on the bottom case to guide and blow to the IGBT and the bridge stack. The IGBT is located at the proximal end of the fan, and the bridge The stack is located at the far end of the fan, and the heat dissipation effect of the bridge stack at the far end is not good, which affects the work of the induction cooker

Method used

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  • Radiating structure for electromagnetic oven
  • Radiating structure for electromagnetic oven
  • Radiating structure for electromagnetic oven

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0025] As shown in Figure 1, the heat sink 2 is fixed on the air outlet of the cooling fan 1, the high-frequency oscillation tube IGBT4 and the bridge stack 3 are fixed on the bottom wall of the heat sink 2, and the contact between the IGBT4 and the bridge stack 3 and the bottom wall of the heat sink 2 The surfaces are all the planes with the largest area, that is, they form a downturned shape. Wherein, the bridge stack 3 and the IGBT 4 are on the front side of the bottom wall of the heat sink 2 , that is, the side with multiple heat dissipation blades. In Figure 1, Figure 1A It is the front structural diagram of the heat dissipation structure of the induction cooker. Figure 1C is the side view, Figure 1D For top view.

Embodiment approach 2

[0026] Embodiment 2 is roughly the same as Embodiment 1, the difference is that the bridge stack 3 and IGBT4 in Embodiment 2 are on the back of the bottom wall of the heat sink, and can be installed as shown in Figure 2, that is, both the fan and the heat sink face the opposite side of Figure 1 superior. in Figure 2A It is a front structural view of this embodiment, Figure 2B It is the structure diagram of the back, Figure 2C for the side view, Figure 2D For top view.

Embodiment approach 3

[0027] Embodiment 3: Preferably, the IGBT 4 and the bridge stack 3 are placed side by side at the air outlet of the cooling fan 1 , that is, the distance from the air outlet to the air outlet is within 20 mm, as shown in FIG. 4 , the distance is 0. At this time, because the distance from the air outlet is close, the cooling effect of the fan on it is more effective. At the same time, since the heat sink 2 , the IGBT 4 , and the bridge stack 3 are closely arranged at the air outlet, compared with the conventional evacuation arrangement in the prior art, the wind pressure is higher and the heat dissipation efficiency is further improved. In the actual test, the equilibrium temperature of the IGBT and the bridge stack is about 85 degrees Celsius under the normal heat dissipation method, and it is even higher when it is made into a flat and thin design. However, the equilibrium temperature of the IGBT of the flat and thin induction cooker heat source in this embodiment is 75-80 Th...

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Abstract

The invention discloses a radiating structure for an electromagnetic oven. Radiating fins are fixed at an air outlet of a radiating fan; and an insulated gate bipolar translator (IGBT) and a bridge rectifier are fixed on the radiating fins and are arranged in a non-overlapped mode in front of the air outlet, so that the fan has higher radiating efficiency on the IGBT and the bridge rectifier, particularly when the IGBT and the bridge rectifier are transversely arranged in parallel. A contact surface between the IGBT and the bridge rectifier and the bottom wall of each radiating fin is set as a plane with the largest area, so that the IGBT and the bridge rectifier have the minimal thickness in the vertical direction. The conventional IGBT and bridge rectifier generally have the thickness of about 5mm only, so that the flatness of a complete electromagnetic oven can be realized. The heat dissipation of the flat electromagnetic oven is an important problem; therefore, when the IGBT and the bridge rectifier are 0 to 20mm away from the air outlet, wind power of the air outlet on a target heat source is more centralized, and the temperature rise of IGBT and the bridge rectifier is effectively reduced. Moreover, due to the arrangement mode, the whole height of the conventional electromagnetic oven product is reduced.

Description

[0001] technical field [0002] The invention belongs to the field of small kitchen appliances, and in particular relates to a heat dissipation structure of an electromagnetic cooker. Background technique [0003] When the existing induction cooker is working, it does not generate an open flame, and the heat generated by the pot during the heating process will be transmitted to the coil or the control circuit under the furnace body. At the same time, the IGBT structure of the control circuit is working. It also emits a lot of heat. In order to ensure the normal operation of the induction cooker, the heat generated in the furnace body needs to be discharged in time. For this reason, the induction cooker is usually provided with a fan and an air inlet and outlet. In a traditional induction cooker, all electronic components are arranged on a control circuit board and intricately arranged in the furnace body. Therefore, the local temperature of the induction cooker is too high...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F24C15/00F24C7/00
Inventor 蔡才德高晖
Owner ZHEJIANG SUPOR ELECTRICAL APPLIANCES MFG CO LTD