Radiating structure for electromagnetic oven
A heat dissipation structure and technology of an induction cooker, applied in the field of small kitchen appliances, can solve the problems of affecting the work of the induction cooker, poor heat dissipation effect of the bridge stack, inability to realize the industrial design of ultra-thin products, etc., and achieve the effect of high heat dissipation efficiency
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Embodiment approach 1
[0025] As shown in Figure 1, the heat sink 2 is fixed on the air outlet of the cooling fan 1, the high-frequency oscillation tube IGBT4 and the bridge stack 3 are fixed on the bottom wall of the heat sink 2, and the contact between the IGBT4 and the bridge stack 3 and the bottom wall of the heat sink 2 The surfaces are all the planes with the largest area, that is, they form a downturned shape. Wherein, the bridge stack 3 and the IGBT 4 are on the front side of the bottom wall of the heat sink 2 , that is, the side with multiple heat dissipation blades. In Figure 1, Figure 1A It is the front structural diagram of the heat dissipation structure of the induction cooker. Figure 1C is the side view, Figure 1D For top view.
Embodiment approach 2
[0026] Embodiment 2 is roughly the same as Embodiment 1, the difference is that the bridge stack 3 and IGBT4 in Embodiment 2 are on the back of the bottom wall of the heat sink, and can be installed as shown in Figure 2, that is, both the fan and the heat sink face the opposite side of Figure 1 superior. in Figure 2A It is a front structural view of this embodiment, Figure 2B It is the structure diagram of the back, Figure 2C for the side view, Figure 2D For top view.
Embodiment approach 3
[0027] Embodiment 3: Preferably, the IGBT 4 and the bridge stack 3 are placed side by side at the air outlet of the cooling fan 1 , that is, the distance from the air outlet to the air outlet is within 20 mm, as shown in FIG. 4 , the distance is 0. At this time, because the distance from the air outlet is close, the cooling effect of the fan on it is more effective. At the same time, since the heat sink 2 , the IGBT 4 , and the bridge stack 3 are closely arranged at the air outlet, compared with the conventional evacuation arrangement in the prior art, the wind pressure is higher and the heat dissipation efficiency is further improved. In the actual test, the equilibrium temperature of the IGBT and the bridge stack is about 85 degrees Celsius under the normal heat dissipation method, and it is even higher when it is made into a flat and thin design. However, the equilibrium temperature of the IGBT of the flat and thin induction cooker heat source in this embodiment is 75-80 Th...
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