Semiconductor device packages and methods for manufacturing the same
A manufacturing method and semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems of increased production costs, consuming process time, increased production costs and time, etc.
Active Publication Date: 2012-07-25
ADVANCED SEMICON ENG INC
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Problems solved by technology
Making the size and shape fit each other, and the relative position of the cover and the package with a certain degree of accuracy will lead to increased manufacturing costs and time-consuming process
Due to the need to make the size and shape match each other, semiconductor device packages of different sizes and shapes need to be matched with different covers to accommodate different packages, which will further increase the production cost and time
Method used
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[0053] definition
[0054] The following definitions apply in certain aspects with respect to certain embodiments of the invention. These definitions are detailed here.
[0055] As used herein, the words "a" and "the" may refer to a plurality, unless the context clearly indicates that "a" and "the" refer to a singular number. Thus, for example, reference to a ground element includes a plurality of ground elements unless the context clearly dictates that "a" or "a" is singular.
[0056]As used herein, the word "group" means a group of one or more elements. Thus, for example, a set of film layers may include a single film layer or a plurality of film layers. An element of a group may also represent a component of the group. The elements of a set may be identical to each other or different from each other. In some examples, elements of a group may share one or more common characteristics.
[0057] As used herein, the word "adjacent" means close to or adjacent to. Adjacent ...
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Described herein are semiconductor device packages with EMI shielding and related manufacturing methods. In one embodiment, a semiconductor device package includes a circuit substrate, an electronic device, an encapsulant, and a conductive layer. The substrate includes a carrying surface, an opposing bottom surface, and a pad. The device is disposed adjacent to the carrying surface and is electrically connected to the substrate. The encapsulant is disposed adjacent to the carrying surface, encapsulates the device, and includes a center portion and a surrounding peripheral portion that is lessthick than the center portion. An opening exposing the pad is formed in the peripheral portion. The conductive layer conformally covers the encapsulant and traverses the opening to connect to the pad. The semiconductor device packages can increases the output of cutting process, and can effectively enhance the EMI shielding efficacy of the package structure. In addition, the reliability of the package can be improved.
Description
technical field [0001] The invention relates to a semiconductor element package and a manufacturing method thereof, and in particular to a semiconductor element package with electromagnetic interference shielding and a manufacturing method thereof. Background technique [0002] Semiconductor devices are becoming increasingly complex, at least in part, due to user demands for increased processing speed and reduced device size. While the benefits of increased processing speed and reduced device size are significant, the characteristics of these semiconductor devices can also create problems. In particular, a higher clock speed increases the frequency of signal level transitions, so that the intensity of electromagnetic emissions with higher frequencies or shorter wavelengths increases. Electromagnetic emissions can be radiated from a source semiconductor device and incident on adjacent semiconductor devices. If the intensity of the electromagnetic emission to adjacent semico...
Claims
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IPC IPC(8): H01L23/31H01L23/552H01L21/50H01L21/56
CPCH01L24/97H01L2924/1815H01L2924/01082H01L24/95H01L2924/01047H01L24/81H01L2924/01079H01L2224/97H01L23/552H01L2224/16H01L23/49811H01L2924/01033H01L2924/15311H01L2924/01029H01L23/3128H01L2924/01078H01L24/16H01L2224/16225H01L2924/01013H01L2924/014H01L2924/3025H01L21/561H01L2924/01024H01L21/565H01L2224/48227H01L2924/15151H01L2924/181H01L2224/81H01L2224/85H01L2924/00012
Inventor 金锡奉尹妍霰李瑜镛
Owner ADVANCED SEMICON ENG INC