Device and method for centering nozzle and wafer

A centering device and spray nozzle technology, applied in the direction of liquid cleaning method, chemical instrument and method, cleaning method and utensils, etc., to avoid personal safety hazards and facilitate replacement

Inactive Publication Date: 2011-06-01
BEIJING SEVENSTAR ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problems to be solved in the present invention are: how to accurately judge the position of the nozzle, and ensure that the physical cente

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  • Device and method for centering nozzle and wafer
  • Device and method for centering nozzle and wafer
  • Device and method for centering nozzle and wafer

Examples

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Example Embodiment

[0029] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0030] like figure 1 As shown, it is a schematic structural diagram of a centering device for an injection nozzle and a wafer carrier according to an embodiment of the present invention, the device includes: a wafer loading module, a position detection module, a parameter setting module and a position adjustment module,

[0031] The wafer loading module is a disk with the same outer diameter as the outer diameter of the wafer, and is used for loading wafers;

[0032] The position detection module is placed on the wafer loading module, and is used to identify the position and contour of the nozzle in real time, obtain the position and contour data of the nozzle, and send t...

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Abstract

The invention discloses a device and method for centering a nozzle and a wafer. The device comprises a wafer loading module, a position detection module, a parameter setting module and a position adjustment module, wherein the wafer loading module is used for loading the wafer; the position detection module is used for identifying the position and the profile of the nozzle in real time so as to acquire data of the position and the profile of the nozzle; the parameter setting module is used for setting a reference point of the nozzle according to the data of the position and the profile; and the position adjustment module is used for adjusting the position of the nozzle according to the position parameter to ensure that the reference point of the nozzle is aligned to the geometric center on the upper surface of the wafer loading module. By detecting and adjusting the position of the nozzle, the method realizes centering of the nozzle and the wafer to ensure that the defect of etching or insufficiently cleaning of the center area due to the deviation of the nozzle and the physical center of the wafer can be overcome.

Description

technical field [0001] The invention relates to the technical field of adjustment and detection of semiconductor equipment components, in particular to a centering device and method for an injection nozzle and a wafer. Background technique [0002] With the rapid development of integrated circuits, their critical dimensions are getting smaller and smaller, and the typical process size has exceeded 32nm, which also reduces the size of Die (small pieces of semiconductor wafers) with similar structures. In the cleaning system of wafer wet processing system (such as wet etching), there are more and more cases of insufficient etching or cleaning in the central area due to the deviation between the chemical injection nozzle and the physical center of the wafer. The drop in yield directly affects the overall yield of the fab, and this problem is more serious in the smaller size semiconductor process. In a single-wafer wet cleaning and etching system, due to the complex assembly re...

Claims

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Application Information

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IPC IPC(8): H01L21/00B08B3/02
Inventor 万晓强吴仪
Owner BEIJING SEVENSTAR ELECTRONICS CO LTD
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