Polycrystalline light-emitting diode packaging structure for generating similar round light-emitting effect

A technology of light-emitting diodes and light-emitting effects, which is applied to electrical components, electrical solid-state devices, circuits, etc., to achieve the effects of long service life, stable voltage and stable current.

Inactive Publication Date: 2012-10-31
PARAGON SEMICON LIGHTING TECH
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the ballasts of general energy-saving light bulbs and energy-saving lamp tubes are fixed. If the old ones are to be replaced with new ones, the ballasts must be discarded together. After coating, it will still inevitably cause serious pollution to the environment after being discarded

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polycrystalline light-emitting diode packaging structure for generating similar round light-emitting effect
  • Polycrystalline light-emitting diode packaging structure for generating similar round light-emitting effect
  • Polycrystalline light-emitting diode packaging structure for generating similar round light-emitting effect

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0058] see Figure 1A to Figure 1D As shown, the following is a detailed description (steps S100 to S108) of the manufacturing method of the "multi-chip light-emitting diode package structure P for producing a circular light-emitting effect" exemplified in the first embodiment of the present invention:

[0059] Please refer to Figure 1A As shown, first, a substrate unit 1 is provided, which has a substrate body 10, a plurality of conductive lines C arranged on the upper surface of the substrate body 10, a plurality of conductive pads 16 arranged on the upper surface of the conductive lines C, A heat dissipation layer 17 disposed on the bottom of the substrate body 10 , and an insulating layer 18 disposed on the upper surface of the substrate body 10 and used to cover part of the conductive lines C to expose the conductive pads 16 (step S100 ). Therefore, the heat dissipation layer 17 can be used to increase the heat dissipation performance of the substrate unit 1, and the in...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a polycrystalline light-emitting diode packaging structure for generating a similar round light-emitting effect, comprising a base plate unit, a light-emitting unit and a packaging unit, wherein the base plate unit is provided with a base plate body and a plurality of conductive lines which are separated mutually at a preset distance and are arranged on the base plate body; each conducting line is provided with a plurality of extending parts, the extending parts of every two conducting lines are mutually adjacent selectively, and are mutually and alternatively arranged; the light-emitting unit is provided with a plurality of light-emitting diode crystalline grains which are selectively and electrically arranged on the base plate unit and are arranged into a similar round shape; and the packaging unit is provided with light-transmitting packaging colloid which is formed on the upper surface of the base plate unit so as to cover the light-emitting diode crystalline grains. The polycrystalline light-emitting diode packaging structure has the advantages that the current is stable, the service life is long, the line bonding time is saved, the line bonding efficiency is improved, the yield of line bonding is increased, the light-emitting efficiency of the light-emitting diode crystalline grains can be improved, the light-emergent angles of the light-emitting diode crystalline grains can be controlled and the like.

Description

technical field [0001] The invention relates to a packaging structure of a multi-chip light-emitting diode, in particular to a packaging structure of a multi-chip light-emitting diode for producing a circular light-emitting effect. Background technique [0002] The invention of electric light can be said to have completely changed the way of life of all human beings. If we live without electric light, all work will stop at night or when the weather is bad; The way of construction or the way of life of human beings will be completely changed, and all human beings will not be able to progress because of this, and will continue to stay in a relatively backward age. [0003] Therefore, the lighting equipment used in the market today, such as fluorescent lamps, tungsten filament lamps, and even the energy-saving light bulbs that are widely accepted by the public, have been widely used in daily life. However, most of these lamps have disadvantages such as fast light decay, high ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075H01L33/62H01L33/52
CPCH01L2224/48091
Inventor 吴朝钦
Owner PARAGON SEMICON LIGHTING TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap