Stack type differential inductor
A differential inductance, stacking technology, applied in the field of microelectronics, can solve the problem of large area of inductance, achieve the effect of improving quality Q value, reducing production cost, and reducing chip area
Inactive Publication Date: 2011-06-08
SHANGHAI HUA HONG NEC ELECTRONICS
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Problems solved by technology
However, in order to obtain a larger inductance value, the inductor of the traditional differential structure still needs a relatively large area
Method used
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[0014] The stacked differential inductor described in the present invention is a multi-layer structure, including: upper and lower metal coils, the upper and lower metal coils have symmetrical patterns; there are inductor ports on the metal coils; the first layer of metal coils starts from one port of the inductor, passes through A half-circle of metal wiring is connected to another layer of metal wires through an interlayer through hole; another layer of metal is routed through a half circle, connected to the first layer of metal through an interlayer through hole, and the upper and lower layer metal coils are interconnected.
[0015] In more detail, the planar structure of stacked differential inductance with upper and lower layers aligned in the present invention (taking two layers of equal thickness metal and three turns of octagonal inductance as an example), its plan view is shown in figure 2 , its three-dimensional structure see image 3 . from figure 2 It can be se...
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The invention discloses a stack type differential inductor. The stack type differential inductor has a multilayer structure, and comprises an upper layer metal coil and a lower layer metal coil, wherein the upper layer metal coil and the lower layer metal coil have symmetric patterns; the metal coils are provided with inductance ports; the first layer metal coil passes through a half cycle of metal wire and an interlayer through hole and is connected with another layer metal wire from one port; the other layer metal passes through the half circle of wire and the interlayer through hole and is connected with the first layer metal; and the upper layer metal coil is interconnected with the lower layer metal coil. Since the mutual inductance between the completely symmetric upper layer metal and lower layer metal is fully utilized, the inductance of the inductor is effectively improved under the same area condition compared with the inductance of the conventional differential inductor. Both quality (Q) factor and inductance are obviously improved under the same area condition.
Description
technical field [0001] The invention relates to the field of microelectronics, in particular to a differential inductor using a stacked structure. Background technique [0002] At present, a large number of passive devices are included in integrated circuits, among which on-chip inductors are a very important one, and on-chip inductors are one of the important components of radio frequency CMOS / BiCMOS integrated circuits. In typical wireless products, inductive components have a significant impact on the overall RF performance. Therefore, the design and analysis of these inductive components have also been extensively studied. As the core component of the RF circuit, the inductor can usually affect the overall performance of the entire circuit. At present, on-chip inductors with high quality factors are widely used in RF circuit modules such as voltage-controlled oscillators and low-noise amplifiers. The stacked on-chip inductor greatly reduces the chip area and reduces t...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L23/522H01F17/00H01F27/28H01F27/29H01F37/00
CPCH01L23/5227H01F17/0013H01L2924/0002H01L2924/00
Inventor 邱慈云徐向明蔡描
Owner SHANGHAI HUA HONG NEC ELECTRONICS