Method for preparing trimmer

A dresser and abrasive grain technology, which is applied in semiconductor/solid-state device manufacturing, manufacturing tools, metal processing equipment, etc., can solve problems such as shedding, cracks, and easy generation of bubbles in the resin layer, so as to increase the holding force and reduce the bubble content. Effect

Inactive Publication Date: 2011-06-15
林舜天 +1
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Problems solved by technology

[0006] The sintered and brazed bond layer is used to fix the structure of diamond abrasive grains. Under the action of high temperature or the erosion of high temperature binder, diamond abrasive grains are easy to deteriorate and produce cracks; therefore, when diamond abrasive grains are used for polishing pads When trimming, it is easy to fall off or break
The method of fixing the diamond abrasive grains with the resin layer does not have the above situation, but the resin layer is prone to air bubbles. When the air bub

Method used

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  • Method for preparing trimmer
  • Method for preparing trimmer
  • Method for preparing trimmer

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Embodiment Construction

[0050] Such as figure 1 , Figure 2-1 , Figure 2-2 , Figure 3-1 , Figure 3-2 , Figure 4 shown. The preparation method of the trimmer according to the first embodiment of the present invention comprises the following steps:

[0051] (a1) The grinding ends 111 of a plurality of abrasive grains 11 are bonded to the bottom wall 311 of a plurality of grooves 31 by the adhesive 12 respectively; 12 bonded above a flat lower mold 30;

[0052] (a2) placing a base plate 4 in an upper mold 32 and placing it above a plurality of abrasive grains 11;

[0053] (a3) In a closed space 3, the pressurized liquid resin 5 is distributed in the distribution space 33 between the lower mold 30 and the substrate 4, and the closed space 3 is vacuumized;

[0054] (a4) solidify the liquid resin 5 and combine with the substrate 4 and the plurality of abrasive grains 11 to form a structure 61 of the first embodiment;

[0055] (a5) Take out the structure 61, such as Figure 3-1 , Figure 3-2A...

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Abstract

The invention discloses a method for preparing a trimmer, which comprises: fixing the grinding ends of a plurality of abrasive particles on a lower die by adhesive, pouring liquid resin, allowing the liquid resin to solidify to fixedly combine with the plurality of abrasive particles and removing the adhesive adhered on the grinding ends. During the liquid resin pouring operation, the plurality of abrasive particles do not shift and have the same protruding height, and the grinding end face of the trimmer is flatter; and the resin combined with the plurality of abrasive particles, before solidification, is subjected to pressurization and vacuumizing to reduce the air bubble content of the resin and increase the holding force of the resin for the plurality of abrasive particles, so that the plurality of abrasive particles do not strip when trimming a grinding pad.

Description

technical field [0001] The present invention relates to implements for conditioning or conditioning chemical mechanical polishing (CMP) pads, and more particularly to methods of making conditioners. Background technique [0002] Chemical Mechanical Polishing (CMP) is a precision polishing process during wafer production, the purpose is to completely planarize the wafer surface so that the designed micro circuit pattern can be completely distributed on the wafer through the exposure and development process. During chemical mechanical polishing, the abrasive liquid is continuously added to the rotating polishing pad, and the polishing of the wafer surface is completed by means of the mechanical grinding of abrasive grains and the corrosion of chemical oxidants, so that the wafer surface is fully planarized. [0003] Polishing debris builds up on the surface of the polishing pad during the grinding process. The accumulation will cause the top of the polishing pad to be glazed ...

Claims

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Application Information

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IPC IPC(8): B24B53/12H01L21/302
Inventor 林舜天宋健民
Owner 林舜天
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