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Impressing component, preparation method thereof and impressing forming method of light guide plate

A molding method and light guide plate technology, applied in printing plate preparation, printing plate copying, printing, etc., can solve the problems of difficult embossing structure and high processing cost

Inactive Publication Date: 2011-06-29
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the microstructure on the surface of the light guide plate is relatively complex, it becomes very difficult to process the corresponding embossing structure on the circumferential surface of the embossing cylinder, and the processing cost is relatively high

Method used

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  • Impressing component, preparation method thereof and impressing forming method of light guide plate
  • Impressing component, preparation method thereof and impressing forming method of light guide plate
  • Impressing component, preparation method thereof and impressing forming method of light guide plate

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Embodiment Construction

[0014] The embossing component and its manufacturing method and light guide plate molding method of the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0015] see figure 1 , the embossing assembly 100 of the embodiment of the present invention includes a cylinder 11 and an embossing layer 12 wound and combined on the peripheral surface of the cylinder 11 . The embossed layer 12 is formed by electroforming, and an embossed structure 121 is formed on its outer surface. The embossed structure 121 can be a complex microstructure, such as any one or a combination of water drop microstructures, pyramidal microstructures, and convex or groove structures extending along a curve. The embossing component 100 is used for printing. A microstructure complementary in shape to the embossed structure 121 may be formed by embossing.

[0016] The drum 11 may be formed of conductive materials, such as metals ...

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Abstract

An impressing component comprises a drum and an impressing layer which is formed through electrotyping, wherein, the impressing layer is reeled and bonded with the circumference surface of the drum, and an impressing structure is formed by the outer surface of the impressing layer. A preparation method of the impressing component comprises the steps as follows: a pre-arranged structure is formed on the surface of substrates which can be used as an electrotyping master mould, the substrates are taken as the electrotyping master mould, the impressing layer provided with the impressing structure is formed through electrotyping, the impressing layer is peeled off, and the drum is provided to reel the impressing layer so as to lead the impressing layer to be bonded with the circumference surface of the drum. The impressing structure with a complicated structure can be formed by utilizing the preparation method of the impressing component.

Description

technical field [0001] The invention relates to an embossing component, a preparation method thereof, and a light guide plate embossing molding method using the embossing component. Background technique [0002] The backlight module is an important component of the liquid crystal display module used in LCD monitors, mobile phones, PDAs, digital cameras, etc. With the rapid development of the display industry, light-weight, ultra-thin, and low-energy backlight modules have become the development trend of research in this field. The light guide plate is an important optical component in the backlight module, and its structure and performance directly affect the quality of the backlight source. A traditional light guide plate processing method is: first adopt micro-machining, that is, use cutting tools, such as diamonds, to cut microstructures on the mold; and then obtain the light guide plate by injection molding. Adopting this method will inevitably produce some injection h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41N1/20B41C1/18B41C3/08G02F1/13357
Inventor 林大为吴锡章
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD