Grounding/supporting device and plasma treatment equipment employing same

Abstract

The invention provides a carrier grounding / supporting device used for plasma treatment equipment. The device comprises a rigid support column, a carrier contact part and an elastic part, wherein the carrier contact part is located at the top end of the support column and used for supporting a carrier in the plasma treatment equipment and enabling the carrier to electrically grounded; and the height of the elastic part can be changed within the elastic range when the elastic part acts under pressure, so that the integral height of the grounding / supporting device can be changed. Additionally, the invention further provides plasma treatment equipment, which comprises a process chamber, a carrier arranged in the process chamber, and a plurality of grounding / supporting device arranged below the carrier and provided by the invention. The grounding / supporting device and the plasma treatment equipment can solve the problems of the carrier, such as no common surface and the like, and enables the carrier to be grounded and supported effectively.

Description

technical field [0001] The invention relates to the technical field of microelectronics, in particular to a support device and plasma processing equipment using the device. Background technique [0002] The birth of solar cells enables human beings to directly convert solar energy into electrical energy and utilize it. With the development of the solar cell production industry, how to improve the quality of solar cells and thus improve the photoelectric conversion efficiency has become a new topic faced by relevant enterprises. Therefore, it is necessary for those skilled in the art to continuously improve existing equipment and processes in order to adapt to new market requirements. [0003] In the production process of solar cells, a thin film deposition process is often required on the wafer surface. This is a very critical process link. At present, this process is mostly completed by plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition, ...

AI Technical Summary

Problems solved by technology

The rigid support device 5 of this structure has the following problems in practical applications: first, if the tops of all the rigid support devices 5 cannot be leveled, part of the rigid support device 5 will be in a suspended state and cannot contact the carrier plate, Therefore, the weight of the carrier board can only be borne by a few rigid support devices 5, which eventually cause problems such as a decrease in the level of the carrier board and uneven lifting; and, because the rigid support device 5 also functions to ground the carrier board , if each area of ​​the carrier board cannot be uniformly and completely supported, then the grounding effect of the carrier board area contacted by the rigid support device 5 is bound to be better than that of the suspended area, which will lead to the problem of uneven charge distribution in each area of ​​the carrier board; Whether it is the uneven lifting of the carrier board or the uneven grounding will affect the final product quality

[0007] but yes image 3 The height adjustment of the rigid support device shown needs to be adjusted repeatedly, and the efficiency of the whole process is very low. With the changes of temperature and force during the operation of the equipment, as well as the deformation and deviation caused by the aging of the equipment, it needs to be calibrated and re-adjusted frequently. Adjusting the height is not only very cumbersome but also seriously affects production efficiency

Sometimes, even if the height is adjusted under normal temperature conditions, when the equipment is running at high temperature, the relevant components will be deformed due to heat, which will cause the various rigid support devices to not evenly contact the carrier board, and also cause problems of uneven support and grounding

Moreover, due to the large size of the carrier board (about 1500mm×2000mm), it is inevitable that there will be errors in the processing of the carrier board. Even if the processing error is small, the carrier board will produce certain deformation or installation errors due to factors such as its own deflection. etc. These factors will cause non-coplanarity of the lower surface of the carrier board (ie, the ground plane)

Therefore, even if the top ends of each rigid support device are completely flush, the support and grounding effect of the final carrier cannot be guaranteed.

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