Durable glass housings/enclosures for electronic devices
A technology for electronic equipment and glass, used in transportation and packaging, thin material handling, etc., can solve problems such as user dissatisfaction, increased weight, damage to portable computing equipment, etc.
Inactive Publication Date: 2011-07-13
CORNING INC
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Unfortunately, the added weight of stronger, more rigid structures can be unsatisfactory to the user, while bending / deformation of lighter structures can damage the internal components of portable computing devices
Method used
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Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0040] ○Example 1 represents the broadest compositional series;
[0041] o Examples 2 and 3 represent first and second pull-down compositions, respectively;
Embodiment 4 and 5
[0042] o Examples 4 and 5 represent the third pull-down composition listed; and
[0043] o Examples 6 and 7 represent the fourth pulldown composition listed.
[0044] In addition, Table 1 discloses the following properties for each representative composition: strain point (strain), annealing point (annealing), softening point (softening), density (density), and coefficient of thermal expansion (CTE).
[0045] Table 1
[0046]
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Abstract
The invention relates to glass articles suitable for use as electronic device housing / enclosure or protective cover which comprise a glass material. Particularly, a housing / enclosure / cover comprising an ion-exchanged glass exhibits the following attributes: (1) radio, and microwave frequency transparency, as defined by a loss tangent of less than 0.03 and at a frequency range of between 15 MHz to 3.0 GHz; (2) infrared transparency; (3) a fracture toughness of greater than 0.6 MPa*m<1 / 2>; (4) a 4-point bend strength of greater than 350 MPa; (5) a Vickers hardness of at least 450 kgf / mm<2> and a Vickers median / radial crack initiation threshold of at least 5 kgf; (6) a Young's Modulus ranging between about 50 to 100 GPa; (7) a thermal conductivity of less than 2.0 W / m DEG C; and (9) at least one of the following attributes: (i) a compressive surface layer having a depth of layer (DOL) greater and a compressive stress greater than 400 MPa, or, (ii) a central tension of more than 20 MPa.
Description
[0001] Related Application Cross Reference [0002] This application claims priority under 35 U.S.C. §119(e) to U.S. Provisional Application No. 61 / 090719, filed August 21, 2008. technical field [0003] This invention relates to glass materials useful as durable housings or enclosures for electronic equipment. In particular, the present invention relates to ion-exchanged glass articles having high strength, low thermal conductivity, and near IR, radio frequency, and microwave frequency transmission, which are suitable for use as durable enclosures or enclosures for electronic equipment. Background technique [0004] Over the past decade, portable electronic devices such as laptops, PDAs, media players, cellular telephones, etc. (often referred to as "portable computing devices") have become smaller, lighter, and more powerful. One factor driving the development and supply of these small devices is the ability of manufacturers to shrink the electronic components of these de...
Claims
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IPC IPC(8): C03C3/083C03C3/087C03C3/091C03C3/093C03C21/00B32B1/00
CPCC03C3/083C03C3/093C03C3/087C03C21/002C03C3/091Y10T428/265Y10T428/24355Y10T428/131C03C4/00C03C8/00
Inventor J·阿明M·J·德杰纳卡L·R·平克尼K·R·罗辛顿R·萨比亚
Owner CORNING INC
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