Film deposition apparatus

A film-forming device and film-forming technology, which are used in gaseous chemical plating, coatings, electrical components, etc., can solve problems such as the inability to suppress the mixing of the first and second reaction gases, the inability to solve problems, and the inability to achieve sufficient treatment. Long time, high film forming speed and good film quality
CN102134709AActive Publication Date: 2011-07-27TOKYO ELECTRON LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
TOKYO ELECTRON LTD
Publication Date
2011-07-27

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Abstract

A film deposition apparatus has a vacuum chamber in which a turntable placing plural substrates is rotated, the plural substrates come into contact with plural reaction gases supplied to plural process areas and thin films are deposited on surfaces of the plural substrates, and has plural reaction gas supplying portions for supplying the plural processing gases, a separation gas supplying portion for supplying a separation gas and an evacuation mechanism for ejecting the plural processing gases and the separation gas, wherein the plural process areas includes a first process area for causing a first reaction gas to adsorb on the surfaces of the plural substrates, and a second process area, having an area larger than the first process area, for causing the first reaction gas having adsorbed the surfaces of the plural substrates and a second reaction gas to react, and depositing the films on the surfaces of the plural substrates.
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Description

technical field

[0001] The present invention relates to a film forming apparatus for forming a thin film on the surface of the substrate by rotating a turntable on which a plurality of substrates are placed in a vacuum chamber and sequentially contacting the substrates with reaction gases supplied to a plurality of different processing regions. . Background technique

[0002] In the semiconductor process, the following devices are known as examples of devices that perform vacuum processing such as film formation processing and etching processing on substrates such as semiconductor wafers (hereinafter referred to as "wafers"). In this device, a wafer mounting table is installed along the circumferential direction of the vacuum container, and a plurality of process gas supply units are provided above the mounting table, and a plurality of wafers are mounted on a turntable while making a vacuum process while revolving. The so-called batch type device. This device is used when...

Claims

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