Method for cleaning technological cavities of semiconductor

Abstract

The invention provides a method for cleaning technological cavities of a semiconductor. The technological cavities are provided with limiting rings for limiting the cleaning and blowing positions of the scavenge gases. The method comprises the steps: a) carrying out a plurality of continuous waferless auto clean procedures and b) cleaning and blowing argon in the technological cavities, wherein the positions of the limiting rings are changed and the scavenge gases are cleared and blown in each procedure. By adopting the method, the residual particles in the cavities can be effectively removedto maintain the residual particles at a lower acceptable level. The method has the beneficial effects of dispensing with additional cost which is needed in the traditional scheme in which the hardware is changed and having no negative effect on the productivity due to no change of the procedures.

Description

technical field [0001] The invention relates to a semiconductor manufacturing process, in particular to a wafer-free automatic cleaning process cleaning process. Background technique [0002] The development of semiconductor integrated circuit technology has put forward new requirements for interconnection technology, and interconnection integration technology will face a series of technical and physical constraints in the short-term and long-term development. As the dimensions of semiconductor devices continue to shrink, interconnect structures become narrower, resulting in higher and higher interconnect resistances. With its excellent conductivity, copper has become one of the solutions for interconnection integration technology in the field of integrated circuit technology. Copper interconnection technology has been widely used in the technology of 90nm and 65nm technology nodes. [0003] In the copper interconnection process, since the space between the metal lines is g...

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Problems solved by technology

However, increased WAC time and intensity will shorten the life of the electrostatic chuck

Another prior art solution is to increase the frequency of maintenance, but this affects tool productivity

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