Optical device and fabrication method thereof

Abstract

The present invention relates to an optical device and a fabrication method thereof. Optical waveguide and coupler devices include a trench formed in a bulk semiconductor substrate, for example, a bulk silicon substrate. A bottom cladding layer is formed in the trench, and a core region is formed on the bottom cladding layer. A reflective element, such as a distributed Bragg reflector can be formed under the coupler device and / or the waveguide device. Because the optical devices are integrated in a bulk substrate, they can be readily integrated with other devices on a chip or die in accordance with silicon photonics technology. Specifically, for example, the optical devices can be integrated in a DRAM memory circuit chip die.

Description

technical field [0001] The inventive concepts relate to optical devices and methods, and more particularly, to optical waveguides and optical couplers for implementing optical communications, and methods of manufacturing optical waveguides and optical couplers. Background technique [0002] Optical devices such as optical fibers, optical waveguides, and optical couplers are used for high-speed, low-power communications in a variety of devices and systems. Optical interconnects have been used in semiconductor memory devices, modules, and systems to enable high-capacity, high-speed, and low-power communications. In these systems, optical fibers can be used for communication between modules. The optical fiber can be coupled to the memory module and the memory device through the optical coupler, and the optical signal can be transmitted within the module and the memory device through the optical waveguide. [0003] Optical interconnects in memory modules, devices, and systems ...

AI Technical Summary

Problems solved by technology

This results in large and complex devices, modules and systems and also in higher associated costs

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