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Circuit board and manufacturing method thereof

A manufacturing method and circuit board technology, applied in the direction of multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problems of high price, unfavorable PCB multilayer board processing, high cost, and achieve simple steps, easy implementation, and low cost. The effect of manufacturing cost

Active Publication Date: 2011-08-03
HUAWEI MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of the boards with Df<0.003 are PTFE materials, which is not conducive to the processing of PCB multilayer boards; in addition, the price of materials with low Dk and Df is very expensive, resulting in very high product costs

Method used

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  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof

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Experimental program
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Embodiment Construction

[0019] The embodiments of the present invention will be described in detail below with reference to the drawings and specific embodiments.

[0020] The circuit board 100 provided by the embodiment of the present invention includes at least one circuit board unit composed of an adhesive layer 120 and a transmission line 140. An air cavity 124 is formed on the adhesive layer 120 of each circuit board unit, and the orthographic projection of the transmission line 140 falls on the area where the air cavity 124 of the adhesive layer 120 is located.

[0021] See figure 1 , An embodiment of the present invention provides a circuit board 100. The circuit board 100 is composed of a circuit board unit. The circuit board unit includes a reference layer 110, the adhesive layer 120, at least one dielectric layer 130, and the The transmission line 140. The adhesive layer 120 is provided with a slot 122 corresponding to the transmission line 140, and the reference layer 110 and the dielectric la...

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PUM

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Abstract

The embodiment of the invention provides a circuit board, comprising at least one bonding layer and at least one transmission line, wherein an air cavity is formed in the bonding layer; and the orthographic projection of the transmission line falls on the area in which the air cavity of the bonding layer is located. In the circuit board provided by the embodiment of the invention, the air cavity is arranged in the bonding layer of the circuit board, so that the characteristic that the air has low Df value and low Dk value is utilized for reducing the Dk and Df characteristics of the whole circuit board, and further the signal transmission quality of the circuit board is improved; and in addition, the step of arranging the air cavity on the bonding layer is simple, and is easy to realize, so that the manufacturing cost of the circuit board can be reduced.

Description

Technical field [0001] The invention relates to a circuit board, in particular to a circuit board with higher signal transmission quality and a manufacturing method of the circuit board. Background technique [0002] With the rapid development of large-scale integrated circuits, the requirements for data transmission rates are getting higher and higher. The current data transmission rate can reach 100Gbps, and the data transmission rate of 200Gbps, 400Gbps or even higher will be realized in the near future. In order to achieve high transmission rates, the requirements for printed circuit board (PCB) materials are very high, and PCBs are usually required to have low dielectric constant Df and low dielectric loss Dk characteristics. At present, the means to reduce the Df and Dk of PCB boards are mainly modified from glass fiber and resin system, such as: ceramic filling, flat glass fiber, non-epoxy resin (PTFE), etc. However, most of the plates with Df<0.003 are PTFE materials,...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/46
CPCH05K3/4611H05K1/0245H05K3/4697
Inventor 高峰刘山当宗晅
Owner HUAWEI MACHINERY