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Flex-rigid wiring board and method for manufacturing the same

A flexible circuit board, rigid-flex technology, used in printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problem of insufficient position fixation of flexible circuit boards

Inactive Publication Date: 2014-07-30
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is considered that the position fixation of the flexible circuit board by this insulating layer is sometimes insufficient.

Method used

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  • Flex-rigid wiring board and method for manufacturing the same
  • Flex-rigid wiring board and method for manufacturing the same
  • Flex-rigid wiring board and method for manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0131] The flex-rigid wiring board 100 of this embodiment is a printed wiring board. Such as figure 1 (sectional view) and figure 2 As shown in (top view), the flex-rigid circuit board 100 has rigid parts 110 and 120 and a flexible circuit board 130 . The rigid part 110 and the rigid part 120 are connected via a flexible circuit board 130 . That is, rigid part 110 and rigid part 120 face each other with flexible wiring board 130 interposed therebetween. Specifically, both end portions of the flexible printed circuit 130 enter into the rigid portions 110 and 120 . And, the rigid parts 110 and 120 and the flexible circuit board 130 are connected in the entry part. In the figure, the F-R interface F1 corresponds to the interface between the rigid part 110 and the flexible part R100 , and the F-R interface F2 corresponds to the interface between the rigid part 120 and the flexible part R100 . In addition, flexible portion R100 is a flexible portion sandwiched between rigid p...

Embodiment approach 2

[0215] Embodiment 2 of the present invention will be described focusing on differences from Embodiment 1 described above. In addition, here for the above figure 1 Components that are the same as those shown in FIG.

[0216] Such as Figure 23 ~ Figure 25 As shown, the flexible circuit board 130 in the flex-rigid circuit board 100 of this embodiment has a shielding layer 137 and an outer cover layer 139 on one side (for example, the second side).

[0217] The shielding layer 137 is formed on the inner covering layer 135 . The shield layer 137 shields electromagnetic noise from the outside (especially the second surface side) to the wiring layers 132 and 133 and electromagnetic noise from the wiring layers 132 and 133 to the outside (especially the second surface side). The shielding layer 137 is made of, for example, a conductive paste. The thickness of the shielding layer 137 is, for example, about 10 to 30 μm.

[0218] The conductive paste of the shielding layer 137 cont...

Embodiment approach 3

[0225] Embodiment 3 of the present invention will be described focusing on differences from Embodiment 2 described above. In addition, here for the above figure 1 Components that are the same as those shown in FIG.

[0226] Such as Figure 26 ~ Figure 28 As shown, the flexible circuit board 130 in the flex-rigid circuit board 100 of this embodiment has shielding layers 136 , 137 and outer cover layers 138 , 139 on both sides (for example, the first side and the second side).

[0227] With such a structure, since the shielding layers 136 and 137 protect the wiring layers 132 and 133 from both surfaces, it is considered that the flexible wiring board 130 is more resistant to noise. In addition, it is considered that the strength of the flexible wiring board 130 is further improved by protecting the flexible wiring board 130 from both sides by the outer cover layers 138 and 139 .

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Abstract

The invention provides a rigid-flex circuit board and a manufacturing method thereof. The rigid-flex circuit board has: an insulating substrate (10a); a flexible circuit board (130), which is arranged on the side of the insulating substrate (10a); And an insulating layer (20a, 30a) disposed on the interface between the insulating substrate (10a) and the flexible circuit board (130), exposing at least a part of the flexible circuit board (130). Here, the insulating layer (20a, 30a) has a portion (P31, P32) that becomes thinner toward the end surface on the flexible wiring board (130) side. In addition, conductors ( P12 , P22 ) are formed on the thinned portions ( P31 , P32 ).

Description

technical field [0001] The present invention relates to a bendable rigid-flex circuit board partially composed of a flexible substrate and a manufacturing method thereof. Background technique [0002] Patent Document 1 discloses a flex-rigid circuit board having a bent flexible circuit board. The conductor pattern on the flexible wiring board is bent to cover the rigid part. [0003] Patent Document 2 discloses a flex-rigid wiring board in which a flexible wiring board is arranged over the entire surface from a flexible portion to a rigid portion. The conductor pattern on the insulating layer is bent. [0004] Patent Document 3 discloses a flex-rigid wiring board in which a circuit-forming region and a non-circuit-forming region are arranged on both surfaces of a flexible wiring board. The circuit formation region and the non-circuit formation region are mutually integrated with an insulating adhesive. [0005] Patent Document 4 discloses a flex-rigid wiring board in whi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11H05K1/14H05K3/36
CPCY10T29/49128H05K3/4691H05K2201/09827H05K2201/09845Y10T29/49124
Inventor 长沼伸幸高桥通昌青山雅一
Owner IBIDEN CO LTD