4 pi light dipping LED (light emitting diode) ball lamp bulb

A technology of LED ball bulbs and LED strips, applied in light sources, electric light sources, electric light sources, etc., can solve the problems of low light output rate and poor heat dissipation performance, and achieve no electromagnetic radiation, improve heat dissipation performance, and improve light utilization rate. Effect

Inactive Publication Date: 2011-08-17
朱婉露
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the deficiencies of low light output rate and poor heat dissipation performance of existing LED lamps, the present invention provides a 4π light output LED bulb bulb with improved light output rate and enhanced heat dissipation performance

Method used

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  • 4 pi light dipping LED (light emitting diode) ball lamp bulb
  • 4 pi light dipping LED (light emitting diode) ball lamp bulb
  • 4 pi light dipping LED (light emitting diode) ball lamp bulb

Examples

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Embodiment Construction

[0027] The present invention will be further described below in conjunction with the accompanying drawings.

[0028] refer to Figure 1 to Figure 5 , a 4π light-emitting LED bulb, including a joint 1, an LED driver 2 and a bulb cover 3, the LED bulb also includes a heat dissipation ring 4, the upper end of the heat dissipation ring 4 is connected to the joint 1, and the heat dissipation ring The lower end of 4 is connected with the bulb cover 3, and a heat dissipation block 5 with high thermal conductivity is installed in the heat dissipation ring 4. The outer wall of the heat dissipation block 5 is connected with the inner wall of the heat dissipation ring 4, and the bottom surface of the heat dissipation block 5 A transparent lamp post 6 with high thermal conductivity is installed, and the 4πLED lamp bar is installed on the lens lamp post. The 4πLED lamp bar 7 includes a plurality of LED chips connected in series in sequence, and the LED driver 2 is installed inside the heat...

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PUM

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Abstract

The invention relates to a 4 pi light dipping LED (light emitting diode) ball lamp bulb which comprises a joint, an LED driving device and a lamp bulb cover, wherein the lower end of a radiating ring is connected with the joint, and the upper end of the radiating ring is connected with the lamp bulb cover; the radiating ring is internally provided with a radiating block with high-heat conduction property; the outer wall of the radiating block is connected with the inner wall of the radiating ring; the bottom surface of the radiating block is provided with a transparent lamp column with high-heat conduction property; the transparent lamp column is provided with a 4 pi LED lamp strip; the 4 pi LED lamp strip comprises a plurality of LED chips connected in series sequentially; the interior of the radiating ring is provided with the LED driving device; and the LED driving device is electrically connected with the 4 pi LED lamp strip. The invention provides the 4 pi light dipping LED ball lamp bulb capable of promoting bright dipping rate and reinforcing the radiating property.

Description

technical field [0001] The invention relates to an LED bulb. Background technique [0002] In the existing LED light bulbs, LED chips are usually installed on the bottom surface of the substrate, and the LED substrate is usually made of a material with good thermal conductivity. The substrate is provided with a power connection interface, and the power connection interface is electrically connected to the power connection line. A printed circuit is provided, and a plurality of LED chips are arranged on the substrate, and the LED chips include a current-limiting resistor and a voltage stabilizer, and the current-limiting resistor and the voltage stabilizer are both connected to the printed circuit. [0003] Since the light emitted by the LED chip diverges downward, its irradiation range is the part below the substrate, that is, to achieve 2π light output, and part of the light is irradiated to the bottom surface of the substrate, which reduces the light output rate of the LED...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V23/02F21V29/00H05B37/02F21Y101/02F21K9/232F21V29/50F21Y105/18F21Y115/10
Inventor 朱婉露
Owner 朱婉露
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