Winding core and wafer-processing belt wound on same

Abstract

The invention provides a winding core capable of winding a wafer-processing belt into the shape of a scroll, wherein the wafer-processing belt comprises a demoulding membrane provided with an adhesive layer and an adhesive film, and is capable of sufficiently preventing imprints form being formed on the adhesive layer. The wafer-processing belt comprises the demoulding membrane, the adhesive layer which is arranged on the surface of the demoulding membrane and has a required plane shape and the adhesive film which is provided with a label part and a peripheral part, wherein the label part covers the adhesive layer, is arranged to be contacted with the demoulding membrane at the periphery of the adhesive layer, and has the required plane shape; and the peripheral part is arranged to enclose the exterior of the label part. The winding core comprises an alleviating part and a supporting part, wherein moderate winding pressure is generated by the alleviating part at least at a position corresponding to the adhesive layer, and the supporting part is formed outside the alleviating part in the width direction of the wound wafer-processing belt and used for supporting the wafer-processing belt.

Description

technical field [0001] The present invention relates to a winding core for winding a wafer processing tape into a reel shape, and more particularly to a winding core for winding a wafer processing tape having a dicing die bonding film into a reel shape. The soldering film has two functions of dicing tape and die bonding film. Background technique [0002] In recent years, there has been developed a dicing die-bonding film that serves both as a dicing tape for fixing a semiconductor wafer when dicing the semiconductor wafer into individual chips and for bonding the diced semiconductor chip to a lead frame. And packaging substrates, etc. or used for stacking and bonding die-bonding films between semiconductor chips (also called die-attach films) in package-on-package. [0003] Such a dicing / die-bonding film may be subjected to pre-cut processing in consideration of workability such as attaching to a wafer and attaching to a ring frame during dicing. [0004] Examples of pre-...

AI Technical Summary

Problems solved by technology

[0010] However, in the above-mentioned adhesive sheet of Patent Document 1, since the support layer is formed on a part other than the adhesive layer and the adhesive film required for the manufacture of the semiconductor device on the release substrate, the width of the support layer is limited. The outer diameter of the layer and the adhesive film, the width of the support layer are narrow, and there is a problem that the suppression effect on label marks is not sufficient.

In addition, since the support layer usually does not have adhesiveness and is not sufficiently adhered to the release substrate (PET film), the narrowest part of the support layer is likely to float from the release substrate, and the dicing and chips are adhered to the wafer. When soldering the film, the above-mentioned floating part affects the device and causes the problem of damage to the wafer

[0011] In addition, it is also considered to increase the width of the support layer, but since the overall width of the wafer processing tape becomes wider, it becomes difficult to use existing equipment.

In addition, since the support layer is the part that is eventually discarded, if the width of the support layer is increased, the material cost will increase

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