Film sticking method and equipment

Abstract

The invention discloses a film sticking method which is characterized in that an adhesive film roll is driven by an idler wheel for rolling an adhesive film to rotate. By using the film sticking method disclosed by the invention, the adhesive film only needs to overcome the viscous force among the layers of the adhesive film without the need of overcoming the rotating resistance of a roller in the film sticking process, and the viscous force is extremely small, thus compared with the tradition method, through the film sticking method and the film sticking equipment disclosed by the invention,the tensile force to the adhesive film is greatly reduced, the deformation of the adhesive film in the length direction is extremely small, and the tensile force after sticking is also extremely small.

Description

Technical field [0001] The invention relates to a film sticking method and film sticking equipment. In particular, it relates to a film attaching method and film attaching equipment used in the field of semiconductor production. Background technique [0002] After wafer production is completed, packaging testing is required. Wafer production and packaging testing are often carried out in different factories, so transportation and transfer between different locations is required. For the sake of wafer safety when moving, the thickness of wafers manufactured by the fab is usually above 700um to prevent cracking during the transfer process. And as the wafer size increases, its thickness is gradually increasing. [0003] In the use of wafers, the development trend of chips is getting thinner and thinner. Therefore, it is necessary to thin the wafer before packaging and testing. Usually the circuit side of the wafer, that is, the side that completes the chip function, is called the...

AI Technical Summary

Problems solved by technology

In this way, when sticking the film, the pulled out adhesive film 103 just needs to cover the edge of the wafer along the length direction, and there is no waste of the adhesive film along the length direction, but the waste is relatively large along the width direction.

The second situation is that if the width of the adhesive film 103 is smaller than the width of the base 101, then even if the clip 104 is opened, since the adhesive film 103 has been pasted on the wafer 102, the clip 104 returns to the position process before starting to stick the film. , or it will be blocked by the adhesive film attached to the wafer 102; or the two side edges in the width direction of the adhesive film 103 will be separated from the clip 104, even if the clip 104 returns to the position before the film is attached, it cannot be clamped smoothly. Film 103, will affect the next film application

Since the adhesive film has been adhered to the wafer at this time, and the wafer cannot be directly stretched or shrunk in the radial direction, the stress generated by the stretching of the adhesive film will cause the wafer to bend

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