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Copper-based brazing filler metal and preparation method thereof

A copper-based solder, electrolytic copper technology, applied in manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems affecting the welding strength, the overall appearance of the weldment, the incomplete weld, poor wetting performance and capillary action, etc. , to achieve the effect of eliminating adverse effects and suppressing flooding

Inactive Publication Date: 2012-10-17
CHENZHOU GERITE WELDING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the poor wettability and capillary action between the solder and the base metal, during welding, part of the solder does not penetrate into the weld and flows out of the weld, resulting in an incomplete weld, which affects the welding strength and the overall weldment beautiful
The problem of diffuse flow generated during soldering has always been a technical problem that plagues solder manufacturers and welding users. People have been eager to find a copper-based solder that can suppress the diffuse flow during welding.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Example 1, the weight percentage of components is: Sn: 3.95%, P: 5.8%, Sb: 0.08%, Si: 0.13%, Ce: 0.25%, La: 0.1%, Cu: 89.69%.

Embodiment 2

[0021] Example 2, the weight percentage of components is: Sn: 5%, P: 6%, Sb: 0.3%, Si: 0.1%, Ce: 0.2%, La: 0.06%, Cu: 88.34%.

Embodiment 3

[0022] Example 3, the weight percentage of components is: Sn: 5.6%, P: 6.5%, Sb: 0.5%, Si: 0.05%, Ce: 0.07%, La: 0.04%, Cu: 87.24%.

[0023] In order to produce this copper-based solder, the preparation method of the present invention is specifically implemented as follows:

[0024] a. Melting Cu: Put the raw material electrolytic copper into the intermediate frequency furnace to melt;

[0025] b. Adding CuP: When the temperature of the electrolytic copper melt in the intermediate frequency furnace rises to 1150°C, add the dried CuP alloy and continue heating until it is completely melted;

[0026] c. Add La, Ce, Si and Sb in turn, and stir evenly;

[0027] d. Add charcoal powder: add 2-3cm thick charcoal powder to cover, turn off the power of the intermediate frequency furnace, and let it stand to cool down;

[0028] e. Adding Sn: When the temperature of the mixed melt drops to 960°C, add Sn, stir evenly and put the mixed melt in the ladle to stand still;

[0029] f. Pouri...

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Abstract

The invention discloses a copper-based brazing filler metal and a preparation method thereof. The copper-based brazing filler metal comprises the following components by weight percent: 3.95-5.6% of Sn, 5.8-6.5% of P, 0.08-0.5% of Sb, 0.05-0.13% of Si; 0.07-0.25% of Ce, 0.04-0.1% of La, and the balance of Cu. The preparation method comprises the following steps: 1) melting Cu; b) adding CuP; c) adding La, Ce, Si and Sb in turn; d) adding charcoal dust; e) heating Sn; f) pouring; g) preparing short ingots: cutting into short ingots about 70-80mm; h) extruding the short ingots into wires; and i) drawing while rising the temperature.

Description

technical field [0001] The invention relates to a copper-based solder used in brazing solder, and also relates to a preparation method of the copper-based solder. Background technique [0002] The existing copper-based solder is widely used for welding red copper and brass or brass and brass because of its advantages of low melting point, good fluidity, high strength and low price. However, due to the poor wettability and capillary action between the solder and the base metal, during welding, part of the solder does not penetrate into the weld and flows out of the weld, resulting in an incomplete weld, which affects the welding strength and the overall weldment beautiful. The flowing problem of this kind of solder produced during welding has always been a technical problem that plagues solder manufacturers and welding users. People have been eager to find a copper-based solder that can suppress the flowing during welding. Contents of the invention [0003] The technical ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/30B23K35/40
Inventor 任国忠
Owner CHENZHOU GERITE WELDING
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