Method for measuring heat storage coefficient of hidden matter under solid material surface by pulsed thermography
A heat storage coefficient and solid material technology, applied in the direction of material thermal conductivity, etc., can solve the problem of quantitative evaluation of the thermal characteristics of hidden foreign objects, and achieve the effect of high measurement accuracy
Active Publication Date: 2012-12-26
BEIJING WAITEKSIN ADVANCED TECH
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[0006] The invention provides a pulse thermal imaging method for measuring the heat storage coefficient of hidden substances under the surface of solid materials, so as to solve the technical problem in the prior art that it is impossible to quantitatively evaluate the thermal characteristics of hidden foreign substances inside objects
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[0026] In order to better understand the shape, structure and characteristics of the present invention, preferred embodiments will be listed below and described in detail with reference to the accompanying drawings.
[0027] In view of the above problems, the present invention provides a new measurement method, which uses infrared thermal imaging to measure the heat storage coefficient of the hidden substance under the surface of the solid material, that is, the defect under the material surface.
[0028] The theoretical basis of the invention is to solve the problem of one-dimensional heat conduction equation under the excitation of pulsed plane heat source, seek the mathematical expression of the influence of heat wave reflection on the surface temperature field in different dielectric materials, and reconstruct the internal heterogeneity of the material according to the change law of the surface temperature field structural information. For a semi-infinite homogeneous mediu...
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Abstract
The invention discloses a method for measuring a heat storage coefficient of a hidden matter under a solid material surface by pulsed thermography, which comprises the following steps of: heating a measured object surface by a pulse heating device, and simultaneously, continuously observing and obtaining a thermography sequence of a variable temperature field of the measured object surface by a thermal infrared imager; determining a time value tm2 when corresponding surface temperature difference between a hidden matter region and a non-defective region in the measured object reaches a maximum value, and a contrast temperature value delta Tc2 (tm2) at that moment, and determining depth L2 of the hidden matter; making a reference test piece by a base material same as the measured object, and taking a reference matter with known heat storage coefficient as the defect in the reference test piece; obtaining the thermography sequence of the surface of the reference test piece; obtaining a peak time tm1 when a maximum temperature contrast ratio of corresponding surfaces of a reference matter region and a non-defective region of the reference test piece appears, and a contrast temperature value delta Tc1 (tm1) at that moment, and determining the depth L1 of the hidden matter; getting a corresponding value R1 of a defective region boundary in the reference test piece; getting a value R2 of a hidden matter region boundary in the measured object; and getting the heat storage coefficient e3 of the hidden matter in the measured object.
Description
technical field [0001] The invention relates to the technical field of non-destructive flaw detection, in particular to an infrared thermal wave technology, which uses a pulse thermal imaging method to measure the heat storage coefficient of a substance hidden under the surface of a solid material. Background technique [0002] Pulse thermal imaging technology is one of the commonly used infrared thermal wave nondestructive testing technologies developed after the 1990s. Based on thermal wave theory, this technology actively applies pulse-shaped controllable thermal excitation to the detected object, and uses infrared thermal imager to continuously observe and record the temperature field changes on the surface of the object, and through modern computer technology and image information Processing technology detects, collects, processes and analyzes time-series thermal wave signals to achieve quantitative diagnosis of internal defects or damages. [0003] The qualitative and...
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IPC IPC(8): G01N25/18
Inventor 陶宁王迅曾智冯立春张存林
Owner BEIJING WAITEKSIN ADVANCED TECH