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Preparation method of embedded copper-aluminum-copper composite board

A composite plate, embedded technology, applied in the field of composite materials, can solve the problem of low bonding force of copper-aluminum composite interface

Inactive Publication Date: 2013-02-27
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This process improves the processing stability, but this existing technology cannot effectively solve the problem of low bonding force at the copper-aluminum composite interface

Method used

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  • Preparation method of embedded copper-aluminum-copper composite board
  • Preparation method of embedded copper-aluminum-copper composite board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Such as figure 1 As shown, this embodiment includes the following steps:

[0024] Step 1: Surface pretreatment

[0025] Divide 0.8×50×150mm 3 The soft HNi65-5 nickel brass is dipped in 10-20% sulfuric acid solution for 4 minutes to remove the oxide film on the surface, rinse the surface with water, and blow dry. Sand the surface with a rolling brush.

[0026] 3×50×150mm 3 The annealed 1050 industrial pure aluminum is kept in a drying oven at 250°C for 30 minutes to remove surface oil. Sand the surface with a rolling brush.

[0027] Step 2: groove the surface of copper alloy and industrial pure aluminum, butt joint and flatten;

[0028] a) Fix the copper alloy strip, and use a stainless steel cutter to process evenly distributed grooves on the surface of the copper alloy strip, as attached figure 2 (a), the groove depth is 0.1mm, the groove width is 0.5mm, and the adhered debris is blown off to form a concave-convex surface on the copper alloy strip;

[0029] b)...

Embodiment 2

[0036] Such as figure 1 As shown, this embodiment includes the following steps:

[0037] Step 1: Surface pretreatment

[0038] 2×50×150mm 3 The soft HNi65-5 nickel brass is dipped in 10-20% sulfuric acid solution for 4 minutes to remove the oxide film on the surface, rinse the surface with water, and blow dry. Sand the surface with a rolling brush.

[0039] 15×50×150mm 3 The annealed 1050 industrial pure aluminum is kept in a drying oven at 250°C for 30 minutes to remove surface oil. Sand the surface with a rolling brush.

[0040] Step 2: groove the surface of copper alloy and industrial pure aluminum, butt joint and flatten;

[0041] a) Fix the copper alloy strip, and use a stainless steel cutter to process evenly distributed grooves on the surface of the copper alloy strip, as attached figure 2 (a), the groove depth is 0.5mm, the groove width is 1mm, and the adhered debris is blown off to form a concave-convex surface on the copper alloy strip;

[0042] b) Fix the a...

Embodiment 3

[0047] Such as figure 1 As shown, this embodiment includes the following steps:

[0048] Step 1: Surface pretreatment

[0049] 1.5×50×150mm 3 The soft HNi65-5 nickel brass is dipped in 10-20% sulfuric acid solution for 4 minutes to remove the oxide film on the surface, rinse the surface with water, and blow dry. Sand the surface with a rolling brush.

[0050] 8×50×150mm 3 The annealed 1050 industrial pure aluminum is kept in a drying oven at 250°C for 30 minutes to remove surface oil. Sand the surface with a rolling brush.

[0051] Step 2: groove the surface of copper alloy and industrial pure aluminum, butt joint and flatten;

[0052]a) Fix the copper alloy strip, and use a stainless steel cutter to process evenly distributed grooves on the surface of the copper alloy strip, as attached figure 2 (b), the groove depth is 0.3mm, the groove width is 0.8mm, blow off the adhered debris, and form a concave-convex surface on the copper alloy strip;

[0053] b) Fix the alumi...

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Abstract

The invention discloses a preparation method of an embedded copper-aluminum-copper composite board in the technical field of composite material. The method comprises the following steps: performing surface cleaning pretreatment on copper alloy and industrial pure aluminum respectively; grooving the surfaces of the copper alloy and the industrial pure aluminum, butting and flattening, and rolling to obtain a three-layer composite board; and finally performing thermal treatment to obtain the embedded copper-aluminum-copper composite board. According to the invention, a groove-shaped concave / convex surface is formed by preprocessing; three layers of board are overlapped to form embedded assembly butt joint, and the contact area between a board and a strip is increased; and mechanical embedding is formed in the subsequent rolling process so that the interface combination strength of the composite board can be maximally improved by nearly 5 times as compared with the direct plane butt-joint rolling method.

Description

technical field [0001] The invention relates to an alloy plate in the technical field of composite materials and a preparation method, in particular to a method for preparing an embedded copper-aluminum-copper composite plate. Background technique [0002] Copper and its alloys have good electrical conductivity, heat conduction, corrosion resistance, antibacterial properties, and have the advantages of bright surface and beautiful appearance; but copper and its alloys have high density, and our country's copper resources are in short supply and the price is high. On the other hand, aluminum and its alloys have the advantages of low density, abundant resources, and cheap price, but their electrical conductivity, thermal conductivity, corrosion resistance, and wear resistance are inferior to copper. As a new type of composite material, copper-aluminum composite material is composed of copper or copper alloy and aluminum or aluminum alloy through a certain preparation process. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P15/00
Inventor 何国谭庆彪张敏达何献忠
Owner SHANGHAI JIAOTONG UNIV