Halogen-free flame-retardant acrylonitrile butadiene styrene (ABS)/polycarbonate (PC) alloy material for electrical engineering and preparation method thereof
An alloy material and electrical engineering technology, which is applied in the field of halogen-free flame retardant ABS/PC alloy new materials for electrical engineering, can solve the problems of high power consumption and labor costs, and high product costs, achieve comprehensive energy-saving costs, and no flame retardants. The effect of precipitation, good heat sealing performance
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Embodiment 1
[0022] Embodiment 1: material formula is as follows: (wt%)
[0023] Acrylonitrile-butadiene-styrene copolymer ABS: 55.0
[0024] Polycarbonate PC: 34.0
[0025] Flame retardant RDP: 7.0
[0026] Silicone Dymgard: 1.5
[0027] Maleic anhydride grafted ABS: 2.1
[0028] Anti-dripping agent FA500B: 0.1
[0029] Antioxidant 1010: 0.2
[0030] Antioxidant 168: 0.1
Embodiment 2
[0031] Embodiment 2: material formula is as follows: (wt%)
[0032] Acrylonitrile-butadiene-styrene copolymer ABS: 58.0
[0033] Polycarbonate PC: 21.5
[0034] Flame retardant RDP: 8.0
[0035] Flame retardant TPP: 4.0
[0036] Silicone Dymgard: 1.0
[0037] Maleic anhydride grafted ABS: 7.0
[0038] Anti-dripping agent FA500B: 0.3
[0039] Antioxidant 1010: 0.1
[0040] Antioxidant 168: 0.1
Embodiment 3
[0041] Embodiment 3: material formula is as follows: (wt%)
[0042] Acrylonitrile-butadiene-styrene copolymer ABS: 56.0
[0043] Polycarbonate PC: 25.0
[0044] Flame retardant BDP: 8.0
[0045] Flame retardant TPP: 7.0
[0046] Silicone Dymgard: 1.0
[0047] Maleic anhydride grafted ABS: 2.0
[0048] Anti-dripping agent FA500B: 0.5
[0049] Antioxidant 1010: 0.25
[0050] Antioxidant 168: 0.25
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