Device for cleaning and treating substrate

Abstract

The invention provides a device for cleaning and treating a substrate; when the substrate treated by liquid medicine is washed, the device can save the dosage of the purified water, reduce liquid emissions, shorten treating time, save space and reduce manufacturing cost. A washing treating room for washing the substrate treated through the liquid medicine is orderly divided into a replacing washing area, a washing area and a direct washing area in a transportation direction of the substrate; and an inlet spray nozzle, a high pressure nozzle, a forced discharging nozzle and an air nozzle are arranged in the replacing water area. The device is controlled so that the substrate sprays out the washing water from the inlet nozzle, the high pressure nozzle and the forced discharging nozzle before transported in the replacing washing area and stops spraying out the washing water from the inlet nozzle, the high pressure nozzle and the forced discharging nozzle after moved out the substrate from the replacing washing area.

Description

technical field [0001] The present invention relates to glass for liquid crystal display (LCD), plasma display (PDP), organic light emitting diode (OLED), field emission display (FED), vacuum fluorescent display (VFD), solar cell panels, etc. Substrates, glass / ceramic substrates for magnetic / optical disks, semiconductor wafers, electronic device substrates, etc., are cleaned after chemical liquid treatment such as resist film stripping treatment and etching treatment. Background technique [0002] In the manufacturing process of devices such as LCD, PDP, etc., after supplying various chemical solutions to the main surface of the substrate to perform chemical treatment such as resist film stripping treatment and etching treatment, when the substrate is subjected to water washing treatment, first, the replacement water washing process is performed. In the chamber (circulating water rinsing treatment section), cleaning water is supplied to the main surface of the substrate imme...

AI Technical Summary

Problems solved by technology

In addition, since all the washing water used in the replacement washing chamber 40 is discarded, a large amount of washing water is used in the replacement washing chamber 40, resulting in a large amount of drain treatment.

Furthermore, since the water washing process is performed while moving the substrate W back and forth in the horizontal direction in the replacement water washing chamber 40, the processing time becomes longer.

In addition, since the size of the replacement washing chamber 40 in the substrate W transfer direction is longer than the size of the substrate W in the substrate transfer direction, the occupied area occupied by the replacement washing chamber 40 becomes larger.

In addition, in order to complete the water washing process of the substrate, a total of three separate and separate replacement water washing chambers (first water washing chamber) 40, second water washing chamber 54, and direct water washing chamber 70 are required, so there are three chambers mentioned above. The occupied area becomes larger, and there is a problem of manufacturing cost of three chambers

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