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Short-circuit deembedding test structure for micro-capacitance MOS (Metal Oxide Semiconductor) varactor and variode

A technology of varactor diodes and test structures, applied in circuits, electrical components, electric solid devices, etc., can solve the problem that the short-circuit de-embedding test structure cannot completely remove parasitic resistance, and achieve the effect of improving consistency

Active Publication Date: 2013-05-01
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0013] In order to solve the problem that the short-circuit de-embedding test structure of the micro-capacitance MOS varactor and varactor diode cannot completely remove the parasitic resistance, and improve the consistency between the parameters of the short-circuit test structure and the actual circuit parameters, the present invention provides a micro-capacitance MOS A short-circuit de-embedding test structure of a varactor and a varactor diode, the short-circuit de-embedding test structure includes: a plurality of metal layers,

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  • Short-circuit deembedding test structure for micro-capacitance MOS (Metal Oxide Semiconductor) varactor and variode
  • Short-circuit deembedding test structure for micro-capacitance MOS (Metal Oxide Semiconductor) varactor and variode
  • Short-circuit deembedding test structure for micro-capacitance MOS (Metal Oxide Semiconductor) varactor and variode

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Embodiment Construction

[0044] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without one or more of these details. In other examples, some technical features known in the art are not described in order to avoid confusion with the present invention.

[0045] In order to thoroughly understand the present invention, a detailed structure will be proposed in the following description, so as to illustrate how the present invention solves the problem that the short-circuit de-embedding test structure of the microcapacitance MOS varactor and varactor cannot completely eliminate the parasitic resistance. Obviously, the practice of the invention is not limited to specific details familiar to those skilled in the semiconductor arts. Preferred embodiments of the present invention are described in detail below, however,...

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Abstract

The invention discloses a short-circuit deembedding test structure for a micro-capacitance MOS (Metal Oxide Semiconductor) varactor and a variode. The short-circuit deembedding test structure comprises a plurality of metal layers; the plurality of metal layers comprise a top metal layer, a first metal layer under the top metal layer and at least one intermediate metal layer, wherein the first metal layer comprises a loop; the top metal layer is divided into four regions which are not mutually connected; the intermediate metal layer comprises intermediate metal layer segments in signal port intermediate metal layer regions and a grounding port intermediate metal layer region; the intermediate metal layer segment in the first signal port intermediate metal layer region, which is nearest to the loop of the first metal layer, is communicated with the intermediate metal layer segment in the second signal port intermediate metal layer region; the first signal port intermediate metal layer region is connected with the loop of the first metal layer; and the second signal port intermediate metal layer region and the loop of the first metal layer are disconnected. According to the structuredisclosed by the invention, the parasitic resistance can be effectively eliminated, and the consistency between test structure parameters and actual circuit parameters is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a short-circuit de-embedding test structure of a microcapacitance MOS varactor and a varactor. Background technique [0002] Metal oxide semiconductor (MetalOxide Semiconductor, hereinafter referred to as: MOS) varactors and varactor diodes are components whose capacitance varies with voltage, and are radio frequency and mixed signal (mix-signal) circuits, especially voltage controlled oscillators (Voltage Controlled Oscillator, hereinafter referred to as: VCO) is an important component in the circuit. With the development of integrated circuits, the driving frequency of some circuits has exceeded 3GHz. For example, in high-speed circuits, the VCO circuit that generates the clock signal needs to use a minimum capacitance value less than or equal to 100fF (10 -10 F) microcapacitance MOS varactor or varactor diode. [0003] In order to obtain various parameters of the circ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/58H01L29/93H01L29/94
Inventor 蒋立飞吴颜明
Owner SEMICON MFG INT (SHANGHAI) CORP
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