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Laser cutting method and equipment

A technology of laser cutting and cutting direction, used in laser welding equipment, welding equipment, metal processing equipment and other directions, can solve the problems of easy carbonization of cutting edges, affecting product quality, etc., to achieve a small heat affected area, good product quality, and improve the beam. The effect of spectral absorption factor

Active Publication Date: 2015-03-11
HANS CNC SCI & TECH
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Problems solved by technology

[0004] The purpose of the embodiment of the present invention is to provide a laser cutting method, aiming to solve the problem that the cutting edge is easy to carbonize after cutting in the existing laser cutting method, which affects the quality of the product

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Embodiment Construction

[0014] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0015] In the laser cutting method provided by the embodiment of the present invention, oxygen is blown at the cutting part of the workpiece, so that the workpiece material is in full contact with oxygen and rapidly vaporized under the action of the laser. Beam spectral absorption factor, the blown oxygen takes away the molten oxides and vapors, and at the same time dissipates the heat outside the cutting area, the heat-affected area is small, the cutting edge is not easy to carbonize, and the product quality is good.

[0016] A laser cutting method, comprising the following steps: blowing oxygen t...

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Abstract

The invention is suitable for laser cutting, and provides a laser cutting method and laser cutting equipment. The method comprises the following steps of: blowing oxygen to a cut position of a workpiece; and irradiating laser to the cut position of the workpiece. The equipment comprises a gas blowing device for blowing the oxygen to the cut position of the workpiece, and a laser for irradiating the laser to the cut position of the workpiece. In the laser cutting method provided by the embodiment of the invention, the oxygen is blown to the cut position of the workpiece, so that a workpiece material is fully contacted with the oxygen and is quickly vaporized under the action of the laser, an oxide film generated by reacting the workpiece material with the oxygen improves the beam spectral absorption factor of a reflecting material in the workpiece, the blown oxygen takes molten oxide and vapor away and disperses heat outside the cut position simultaneously, a heat affected zone is small, a cut edge is difficult to carbonize, and product quality is high.

Description

technical field [0001] The invention belongs to laser processing technology, in particular to a laser cutting method and equipment. Background technique [0002] Laser processing has many advantages, such as high precision, speed and flexibility. Laser cutting is to irradiate the workpiece with a focused high-power laser. When the laser exceeds the threshold power density, the chemical bonds of the long bond-shaped polymer organic matter are interrupted. The material is quickly removed to form a hole, and as the laser beam moves relative to the workpiece, a kerf is formed in the workpiece. [0003] FPC (Flexible Printed Circuit, flexible circuit board, flexible printed circuit board or flexible circuit board, referred to as soft board or FPC) has the characteristics of high wiring density, light weight, and thin thickness. FPC shape processing is an indispensable process in FPC factories. At present, FPC shape processing adopts two technologies, one is mold punching techno...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38B23K26/14B23K26/142
Inventor 高云峰雷群翟学涛吕洪杰杨凯
Owner HANS CNC SCI & TECH
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