Preparation method of copper alloy for high-power LED (light emitting diode) phase-transition internal/external heat dissipators

A high-power, phase-change technology, used in lighting and heating equipment, semiconductor devices of light-emitting elements, cooling/heating devices for lighting devices, etc.

Inactive Publication Date: 2011-10-26
SHANDONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the built-in copper heat dissipation pads used in high-power LEDs, the copper clad layer in the printed circuit board (PCB), and the external aluminum heat sink can only play a rol

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0023] Embodiment 1: A method for preparing a copper alloy for high-power LED phase-change internal and external heat sinks, including the following steps:

[0024] The first step is to determine the maximum temperature allowed by the high-power LED;

[0025] In the second step, according to the maximum allowable temperature of the high-power LED, the determined phase transition temperature range of the copper-based alloy is: 35℃-100℃;

[0026] The third step is based on the phase transition temperature determined in the second step, and then the weight percentage of alloying elements is determined according to the formula Ms(°C)=2112-56.5×(wt%Zn)-153.7×(wt%X);

[0027] The fourth step is to perform smelting of sample quantities according to the determined composition ratio;

[0028] In the fifth step, the smelted sample is kept at 840°C for 30 minutes, and then in boiling water at 100°C for 30 minutes;

[0029] The sixth step is to use a differential thermal analyzer to test and verify ...

Example Embodiment

[0036] Embodiment 2: A method for preparing a copper alloy for high-power LED phase-change internal and external heat sinks, including the following steps:

[0037] The first step is to determine the maximum temperature allowed by the high-power LED;

[0038] In the second step, according to the maximum allowable temperature of the high-power LED, the determined phase transition temperature range of the copper-based alloy is: 40°C;

[0039] The third step is based on the phase transition temperature determined in the second step, and then the weight percentage of alloying elements is determined according to the formula Ms(°C)=2112-56.5×(wt%Zn)-153.7×(wt%X);

[0040] The fourth step is to perform smelting of sample quantities according to the determined composition ratio;

[0041] The fifth step is to keep the smelted sample at 835°C for 28 minutes, and then keep it in boiling water at 100°C for 28 minutes;

[0042] The sixth step is to use a differential scanning calorimeter to test and ...

Example Embodiment

[0049] Embodiment 3: A method for preparing a copper alloy for high-power LED phase-change internal and external heat sinks, including the following steps:

[0050] The first step is to determine the maximum temperature allowed by the high-power LED;

[0051] In the second step, according to the maximum allowable temperature of the high-power LED, the determined phase transition temperature range of the copper-based alloy is: 50℃;

[0052] The third step is based on the phase transition temperature determined in the second step, and then the weight percentage of alloying elements is determined according to the formula Ms(°C)=2112-56.5×(wt%Zn)-153.7×(wt%X);

[0053] The fourth step is to perform smelting of sample quantities according to the determined composition ratio;

[0054] In the fifth step, the smelted sample is kept at 845°C for 32 minutes, and then in boiling water at 100°C for 32 minutes;

[0055] The sixth step is to use a differential thermal analyzer to test and verify wheth...

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PUM

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Abstract

The invention relates to a preparation method of copper alloy for high-power LED (light emitting diode) phase-transition internal/external heat dissipators, which comprises the following steps: (1) determining the maximum allowable temperature of high-power LED; (2) determining the phase transition temperature range of the copper-base alloy; (3) determining the percents of the alloy elements; (4) carrying out sample size melting; (5) carrying out heat treatment on the molten sample; (6) testing to verify whether the transition transition point conforms to the designed value; (7) adjusting the composition; (8) producing and melting; (9) casting; and (10) carrying out homogenizing treatment. The high-power LED heat dissipator made of the copper-base alloy material not only has the copper clad layer in the original built-in copper heat-dissipation pad and printed circuit board (PCB) as well as the conductive heat dissipation and radiation heat dissipation in the external aluminum heat dissipator, but also has the function of phase-transition heat absorption below junction temperature. Every gram of alloy can absorb 7-9 joule more of heat quantity. Besides, the manufacturing cost of the copper alloy is lower than that of pure copper. Therefore, the invention has a high development and application value in manufacturing high-power LED heat dissipators.

Description

technical field [0001] The invention relates to a preparation method of a copper-based alloy for a phase-change internal and external radiator, in particular to a preparation method for a copper alloy for a high-power LED phase-transition internal and external radiator. Background technique [0002] The photoelectric conversion efficiency of the LED is only 15% to 20%, and the remaining 80% to 85% is converted into heat. If the heat cannot be discharged in time, it will seriously affect the luminous efficiency and luminous life of the LED. It is a high power LED. At present, the built-in copper heat dissipation pads used in high-power LEDs, the copper clad layer in the printed circuit board (PCB), and the external aluminum heat sink can only play a role in conduction heat dissipation and radiation heat dissipation, but in controlling temperature rise. None of them have the function of phase transition endothermic suppression of temperature rise. Contents of the invention ...

Claims

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Application Information

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IPC IPC(8): C22C1/02C22C9/00C22F1/08F21V29/00F21Y101/02F21V29/503F21V29/89F21Y115/10
Inventor 耿贵立
Owner SHANDONG UNIV
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