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Method and apparatus for measuring material thermal conductivity based on optical-modulated thermo-emission spectroscopy

A measurement device and thermal emission technology, applied in the direction of thermal development of materials, etc., can solve the problems of fast heat dissipation of low-dimensional structures, complicated experimental devices, unfavorable material/low-dimensional structure thermal characteristics measurement, etc., to achieve fast measurement without damage, detection Sensitive effect

Active Publication Date: 2011-10-26
SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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Problems solved by technology

[0003] The heat dissipation in low-dimensional structures is fast, which brings great difficulties to related experimental measurements
Existing thermal conductivity measurement methods, such as 3ω method, micro-machined suspension device method, transient reflectance measurement method, scanning thermal microscope technology, etc., have problems such as sample pretreatment, complicated experimental equipment, and the need to design special circuits. Facilitate rapid and non-destructive measurement of thermal properties of materials / low-dimensional structures

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  • Method and apparatus for measuring material thermal conductivity based on optical-modulated thermo-emission spectroscopy
  • Method and apparatus for measuring material thermal conductivity based on optical-modulated thermo-emission spectroscopy
  • Method and apparatus for measuring material thermal conductivity based on optical-modulated thermo-emission spectroscopy

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Embodiment Construction

[0024] The following is based on figure 1 and figure 2 The preferred embodiments of the present invention are given and described in detail to better illustrate the technical features and functional characteristics of the present invention, rather than to limit the scope of the present invention.

[0025] Specific implementations such as figure 1 As shown, the device for measuring the thermal conductivity of a material based on light modulation thermal emission spectroscopy includes - a lock-in amplifier 2-1 inserted in the light modulation device 2 between the spectrometer 1-1, the computer 1-2 and the base 4-3, And a chopper 2-2 is arranged on the path where the laser 3 is incident on the base 4-3, so as to form a modulated incident laser. More specifically, the device for measuring the thermal conductivity of materials by step-scanning light-modulated thermal emission spectroscopy of the present invention includes a Fourier transform infrared spectroscopy system 1, which...

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Abstract

The invention discloses a method and an apparatus for measuring material thermal conductivities based on optical-modulated thermo-emission spectroscopy. The apparatus comprises a Fourier transform infrared (FTIR) spectroscopy measuring system, a laser served as a heat source, a lock-in amplifier for connecting a detector and a circuit controlling panel in the FTIR spectrometer, and a chopper positioned on the optical path between a sample / power testing system and the laser. With the apparatus, optical-modulated thermo-emission spectroscopy measuring can be carried out, temperatures of a sample before and after laser radiation can be accurately determined, such that the thermal conductivity of the sample can be obtained. With advantages of fast, non-contacting, and convenient, the apparatus provided by the present invention is suitable for the detection of thermal characteristics of photovoitaic semiconductors.

Description

Technical field: [0001] The invention relates to a method and device for measuring the thermal conductivity of semiconductor optoelectronic materials, specifically, a method and a device for measuring the thermal conductivity of materials based on the light modulation thermal emission spectrum of a step-scan Fourier transform infrared (FTIR) spectrometer. Background technique: [0002] In recent years, the rapid development of microelectronics / optoelectronic devices towards high speed, high density and low power consumption directly leads to the increase of heat generated per unit volume, and the heat dissipation of the system has become a prominent problem. For bulk materials, impurities / defects and dislocations lead to lower thermal conductivity; for low-dimensional structures widely used in devices, phonon confinement and interfacial effects lead to a further decrease in thermal conductivity. Low thermal conductivity will cause heat to accumulate continuously in the mater...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/20
Inventor 邵军吕翔陆卫郭少令褚君浩
Owner SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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