Method and apparatus for measuring material thermal conductivity based on optical-modulated thermo-emission spectroscopy

Abstract

The invention discloses a method and an apparatus for measuring material thermal conductivities based on optical-modulated thermo-emission spectroscopy. The apparatus comprises a Fourier transform infrared (FTIR) spectroscopy measuring system, a laser served as a heat source, a lock-in amplifier for connecting a detector and a circuit controlling panel in the FTIR spectrometer, and a chopper positioned on the optical path between a sample/power testing system and the laser. With the apparatus, optical-modulated thermo-emission spectroscopy measuring can be carried out, temperatures of a sample before and after laser radiation can be accurately determined, such that the thermal conductivity of the sample can be obtained. With advantages of fast, non-contacting, and convenient, the apparatus provided by the present invention is suitable for the detection of thermal characteristics of photovoitaic semiconductors.

Description

Technical field: [0001] The invention relates to a method and device for measuring the thermal conductivity of semiconductor optoelectronic materials, specifically, a method and a device for measuring the thermal conductivity of materials based on the light modulation thermal emission spectrum of a step-scan Fourier transform infrared (FTIR) spectrometer. Background technique: [0002] In recent years, the rapid development of microelectronics / optoelectronic devices towards high speed, high density and low power consumption directly leads to the increase of heat generated per unit volume, and the heat dissipation of the system has become a prominent problem. For bulk materials, impurities / defects and dislocations lead to lower thermal conductivity; for low-dimensional structures widely used in devices, phonon confinement and interfacial effects lead to a further decrease in thermal conductivity. Low thermal conductivity will cause heat to accumulate continuously in the mater...

AI Technical Summary

Problems solved by technology

[0003] The heat dissipation in low-dimensional structures is fast, which brings great difficulties to related experimental measurements

Existing thermal conductivity measurement methods, such as 3ω method, micro-machined suspension device method, transient reflectance measurement method, scanning thermal microscope technology, etc., have problems such as sample pretreatment, complicated experimental equipment, and the need to design special circuits. Facilitate rapid and non-destructive measurement of thermal properties of materials / low-dimensional structures

Images