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Semiconductor device

A semiconductor and insulator technology, applied in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of low heat dissipation performance of semiconductor devices, and achieve the effects of improving heat dissipation performance, increasing heat dissipation, and increasing area

Inactive Publication Date: 2013-09-18
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, a part of the frame that conducts the heat of the semiconductor chip is separated from the heat sink, and the heat dissipation performance of the semiconductor device is lowered.

Method used

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  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

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Experimental program
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Embodiment Construction

[0029] Embodiments of the present invention will be described below with reference to the drawings.

[0030] Embodiment 1

[0031] First, the structure of the semiconductor device according to Embodiment 1 of the present invention will be described. As an example of a semiconductor device, a semiconductor device including a power module in a SIP (Single Inline Package) shape will be described.

[0032] refer to figure 1 with figure 2 , the semiconductor device 10 mainly includes a semiconductor chip 1 , a frame 2 , an insulator 3 , a heat sink 4 , external leads 5 and bonding wires 6 . again, figure 1 In , in order to make it easier to look, the insulator 3 and the heat sink 4 (heat sink) are represented by dotted lines. again, figure 2 A part of the middle external lead 5 and the bonding wire 6 are indicated by dotted lines. The power module 10 a is formed by encapsulating the semiconductor chip 1 , the frame 2 , a part of the external lead 5 , the bonding wire 6 , a...

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Abstract

The semiconductor device (10) of the present invention has a semiconductor chip (1), a frame (2) supporting the semiconductor chip (1), an insulator (3) for packaging the semiconductor chip (1) and the frame (2), and an insulator (3) ) a heat sink (4) configured opposite to the frame (2), the frame (2) is along a surface (4a) of the heat sink (4) and adjacent to a surface (4a) and intersecting with a surface (4a) The other surface (4b) configures at least a part of these two surfaces. With this, a semiconductor device with high heat dissipation performance can be obtained.

Description

technical field [0001] The present invention relates to semiconductor devices, and more particularly to semiconductor devices packaged with an insulator. Background technique [0002] Conventionally, in a semiconductor device, a semiconductor chip, external leads, and the like are packaged with an insulator. As a means of encapsulating with an insulator, pressure injection molding (compression injection molding) is known. In such a transfer mold, a mold is filled with molten resin to encapsulate a semiconductor chip, external leads, and the like with the resin. In this way, a semiconductor package in which the semiconductor chip and external leads are encapsulated with resin is formed. [0003] In recent years, the demand for small-capacity power modules for inverter control of electric motors, which is used in so-called "home appliances" such as air conditioners, has been increasing. In order to produce them cheaply and in large quantities, packages produced by injection ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L23/31
CPCH01L2924/1305H01L2924/13055H01L2924/181H01L2224/45124H01L2224/48091H01L2224/48137H01L2224/48139H01L2224/48247H01L2224/48096H01L2924/00014H01L2924/00H01L2924/00012H01L23/34H01L23/12
Inventor 长原辉明
Owner MITSUBISHI ELECTRIC CORP