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Processing method of surface-mounted pads on thick copper circuit board

A technology of thick copper circuit boards and processing methods, which is applied in the direction of removing conductive materials by chemical/electrolytic methods, can solve problems such as difficult processing, and achieve increased mounting area, increased size, and meet design size requirements Effect

Active Publication Date: 2011-11-16
WUXI SHENNAN CIRCUITS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method directly etches the copper foil and then presses it into the circuit board substrate, which is difficult to process

Method used

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  • Processing method of surface-mounted pads on thick copper circuit board
  • Processing method of surface-mounted pads on thick copper circuit board
  • Processing method of surface-mounted pads on thick copper circuit board

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Embodiment Construction

[0037] In order to describe the technical content, structural features, goals and effects of the present invention in detail, the following will be described in detail in combination with the accompanying drawings. Of course, the surface mount processing of thick copper circuit boards is not limited to the circuit boards of the above specifications, and it can also be applied to the surface mount processing of thick copper circuit boards such as 3OZ, 4OZ, and 6OZ.

[0038] see figure 2 as well as image 3 , the present invention provides a kind of processing method of surface mount of thick copper circuit board, and the surface of thick copper circuit board comprises surface mount graphic area and circuit figure area, and the technological process of processing method is:

[0039] S01: The first outer layer pattern: Cover the circuit pattern area and the surface-mounted pattern area 1 with dry film 2, and expose the copper foil part that needs to be etched off in the line pa...

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Abstract

The invention discloses a processing method of surface-mounted pads on a thick copper circuit board. The processing method comprises the following steps: S01. patterning an external layer for the first time; 2. etching the external layer for the first time; 3. patterning the external layer for the second time; 4. etching the external layer for the second time; and 5. manufacturing a solder mask bridge among the surface-mounted pads by a fractional solder resisting method. The processing method has the beneficial effects that the surface-mounted pads are manufactured by a partitioned etching method, which strengthens size control of the surface-mounted pads and meets the design requirements; and the solder mask bridge among the surface-mounted pads are manufactured by utilizing the fractional solder resisting method so that the solder mask bridge and the circuit board are firmly connected together and are not easily separated from each other.

Description

technical field [0001] The invention relates to the field of processing thick copper circuit boards, in particular to a processing method for surface mounting of thick copper circuit boards. Background technique [0002] Thick copper circuit board: printed circuit board with copper thickness greater than or equal to 3OZ; [0003] OZ: The abbreviation of the symbol ounce, which is called "ounce" in Chinese, is an imperial unit of measurement, 1 ounce = 28.35 grams, in a circuit board, 1OZ means that the average weight of copper foil on an area of ​​1 square foot is 28.35g, in units The weight of the area represents the average thickness of the copper foil. [0004] Surface mount: The pad used for mounting components on the circuit board. Since the top of the surface mount needs to be in contact with the conductive part of the component, in order to ensure the integrity of the conductive power or signal transmission, the size of the top of the surface mount line are strictly...

Claims

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Application Information

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IPC IPC(8): H05K3/06
Inventor 冷科刘海龙郭长峰
Owner WUXI SHENNAN CIRCUITS CO LTD
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