Processing method of surface-mounted pads on thick copper circuit board

A technology of thick copper circuit boards and processing methods, which is applied in the direction of removing conductive materials by chemical/electrolytic methods, can solve problems such as difficult processing, and achieve increased mounting area, increased size, and meet design size requirements Effect

Active Publication Date: 2011-11-16
WUXI SHENNAN CIRCUITS CO LTD
View PDF4 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method directly etches the copper foil and then presses it

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Processing method of surface-mounted pads on thick copper circuit board
  • Processing method of surface-mounted pads on thick copper circuit board
  • Processing method of surface-mounted pads on thick copper circuit board

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0037] In order to explain in detail the technical content, structural features, objectives and effects of the present invention, the following will be described in detail in conjunction with the embodiments and accompanying drawings, and the following embodiments are based on a 5OZ thick copper plate and 10mil / mil surface mount as an example. Of course, the surface attachment processing of the thick copper circuit board is not limited to the circuit boards of the specified specifications, and it can also be applied to the processing of the surface attachment of thick copper circuit boards such as 3OZ, 4OZ, and 6OZ.

[0038] See figure 2 as well as image 3 , The present invention provides a method for processing the surface of thick copper circuit board. The surface of the thick copper circuit board includes a surface area and a circuit pattern area. The process flow of the processing method is:

[0039] S01: The first outer layer pattern: Cover the circuit pattern area and the s...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to view more

Abstract

The invention discloses a processing method of surface-mounted pads on a thick copper circuit board. The processing method comprises the following steps: S01. patterning an external layer for the first time; 2. etching the external layer for the first time; 3. patterning the external layer for the second time; 4. etching the external layer for the second time; and 5. manufacturing a solder mask bridge among the surface-mounted pads by a fractional solder resisting method. The processing method has the beneficial effects that the surface-mounted pads are manufactured by a partitioned etching method, which strengthens size control of the surface-mounted pads and meets the design requirements; and the solder mask bridge among the surface-mounted pads are manufactured by utilizing the fractional solder resisting method so that the solder mask bridge and the circuit board are firmly connected together and are not easily separated from each other.

Description

technical field [0001] The invention relates to the field of processing thick copper circuit boards, in particular to a processing method for surface mounting of thick copper circuit boards. Background technique [0002] Thick copper circuit board: printed circuit board with copper thickness greater than or equal to 3OZ; [0003] OZ: The abbreviation of the symbol ounce, which is called "ounce" in Chinese, is an imperial unit of measurement, 1 ounce = 28.35 grams, in a circuit board, 1OZ means that the average weight of copper foil on an area of ​​1 square foot is 28.35g, in units The weight of the area represents the average thickness of the copper foil. [0004] Surface mount: The pad used for mounting components on the circuit board. Since the top of the surface mount needs to be in contact with the conductive part of the component, in order to ensure the integrity of the conductive power or signal transmission, the size of the top of the surface mount line are strictly...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/06
Inventor 冷科刘海龙郭长峰
Owner WUXI SHENNAN CIRCUITS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap