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Light distribution structure of high-power LED (light-emitting diode)

A high-power, LED packaging technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of large interface loss of light on the LED light-emitting surface, and achieve the effect of reducing interface loss and increasing transmittance

Inactive Publication Date: 2011-11-23
深圳市顶点照明设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem in the prior art that there is an air gap between the LED packaging lens and the light distribution lens, which causes the light emitted by the LED light-emitting surface to have a large interface loss, and to provide a light distribution structure for high-power LEDs

Method used

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  • Light distribution structure of high-power LED (light-emitting diode)
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  • Light distribution structure of high-power LED (light-emitting diode)

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Embodiment Construction

[0020] In the following, the realization, functional features and advantages of the present invention will be further described in conjunction with the embodiments and accompanying drawings.

[0021] As we all know, when light exits or enters the interface, the closer the refractive index of the medium on both sides of the interface is, the smaller the interface loss will be. Therefore, filling the gap between the LED packaging lens and the light distribution lens with a transparent material having a refractive index similar to that of the above two lenses and eliminating the above air gap will greatly reduce the interface loss of light and increase the transmittance of light.

[0022] In a specific embodiment, in order to ensure that the air gap is completely eliminated without damaging the original shape and size parameters of the two lenses, a liquid filling material can be used, or a soft solid solidified from a liquid, such as silica gel, can be used.

[0023] Please refe...

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Abstract

The invention belongs to the field of LED (light-emitting diode) encapsulation and discloses a light distribution structure of a high-power LED (light-emitting diode). The light distribution structure is characterized in that a transparent packing layer is arranged between an LED encapsulation lens and a light distribution lens; and one side of the transparent packing layer is connected with the LED encapsulation lens and the other side of the transparent packing layer is connected with the light distribution lens, and the gap between the LED encapsulation lens and the light distribution lens is packed completely by the transparent packing layer. The light distribution structure of the high-power LED can be used to reduce interface losses of light from the LED greatly and increase the transmissivity of the light.

Description

technical field [0001] The invention relates to the field of LED packaging, in particular to a light distribution structure of a high-power LED. Background technique [0002] As high-power LEDs (Light Emitting Diode, Chinese translation: Light Emitting Diode) are continuously applied in the field of lighting, the packaging of high-power LEDs, especially the design of the light distribution structure of high-power LEDs is becoming more and more important. In use, a lens is often packaged close to the LED light-emitting surface, the common one is hemispherical, some are flat or other shapes, commonly known as "LED package lens"; a hard lens is added to the LED package lens Light distribution lens, commonly known as "light distribution lens". [0003] Such as figure 1 As shown, it is a high-power LED light distribution structure in the prior art. 1 is an LED packaging lens, 2 is a light distribution lens, and 4 is an installation base plate. [0004] Since the LED package l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/58
Inventor 张宏志霍健
Owner 深圳市顶点照明设备有限公司
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