A front-opening wafer box with an elliptical latch structure

Abstract

The present invention is a front-opening wafer box with an elliptical latch structure, which includes a box body with a plurality of slots inside the box body for accommodating a plurality of wafers, and an opening formed on one side of the box body for multiple A wafer input and output, and a door body, has an outer surface and an inner surface, the inner surface of the door body is combined with the opening of the box body, and is used to protect a plurality of wafers placed inside the box body, the door body At least one latch structure is arranged inside the protruding platform on the surface, which includes an elliptical cam and a braking part. The guiding structure at the center, and a narrow and long elastic piece framed on the guiding structure, the pair of fitting parts are embedded in the chute, so that a pair of sliding devices are embedded on the elliptical cam, and the rotation of the elliptical cam is controlled to make The sliding device travels between the socket and the latch hole.

Description

technical field [0001] The present invention relates to a front-opening wafer box, in particular to a door latch structure disposed in the door body of the front-opening wafer box. Background technique [0002] Semiconductor wafers will be transported to different workstations due to the need to go through various processes and to cooperate with process equipment. In order to facilitate the handling of the wafers and avoid external contamination, a sealed container is often used for automatic equipment delivery. Please refer to figure 1 Shown is the schematic diagram of the wafer box of known technology. The wafer pod is a front opening type wafer pod (Front Opening Unified Pod, FOUP), which has a box body 10 and a door body 20. Inside the box body 10, there are multiple slots 11 which can accommodate multiple round pods horizontally. (not shown in the figure), and on one side of the box body 10, there is an opening 12 for loading and unloading of the wafer, and the door ...

AI Technical Summary

Problems solved by technology

However, this method similar to lateral traction tends to generate an offset force in the moving direction of the movable spigot 231, which will cause it to fail to be inserted into the socket 13 of the box body 10, causing the box body 10 to be in contact with the door body 20. Unable to cover smoothly, which will cause troubles in the process

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