LED light source multi-cup module base

Abstract

The invention provides a base for a multi-cup module of an LED light source. The base includes a substrate and a number of reflective cups arranged on the substrate. The whiteness of the light-emitting surface used for installing LEDs on the reflective cup is ≥70; more preferably ≥85 ; The optimal value is ≥88. The base plate and the reflective cup of the base are integrally formed and fired by ceramic or glass, and the base plate is also provided with a small groove extending into the side wall of the reflective cup for installing the circuit board. The invention can reduce the production process of the reflective layer on the traditional LED metal base, simplifies the production process, can greatly save production costs, and is beneficial to mass industrial production. At the same time, the base can be directly produced in a prefabricated manner. After the temperature is increased, the light extraction efficiency of the LED chip will be greatly improved, so the loss of light energy converted into heat energy can be greatly reduced, so its heat dissipation performance will also be greatly improved. The LED lamp made of it has good safety performance and is non-conductive. The unbreakable service life is also greatly improved.

Description

technical field [0001] The invention relates to a lighting device, in particular to an LED lamp. Background technique [0002] LED is a low-voltage light source. Due to its power saving and long life, it has been widely used in various lighting devices. Traditional LED bulbs use metal materials as the substrate for LED packaging. Because the whiteness of the metal substrate itself is relatively low Low, so if it is directly made into the package base of the LED lamp without treatment, its reflective efficiency is not high, especially in the application of high-power LEDs, due to its high heat generation, the product life is low; therefore, the existing metal substrate The luminous surface will be treated first, such as brushing a layer of white paint on the surface as a reflective layer or laminating a layer of white reflective layer to improve its whiteness, but this method, first of all, its process is more complicated and the production cost is higher. At the same time, ...

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Problems solved by technology

[0002] LED is a low-voltage light source. Due to its power saving and long life, it has been widely used in various lighting devices. Traditional LED bulbs use metal materials as the substrate for LED packaging. Because the whiteness of the metal substrate itself is relatively low Low, so if it is directly made into the package base of the LED lamp without treatment, its reflective efficiency is not high, especially in the application of high-power LEDs, due to its high heat generation, the product life is low; therefore, the existing metal substrate The luminous surface will be treated first, such as brushing a layer of white paint on the surface as a reflective layer or laminating a layer of white reflective layer to improve its whiteness, but this method, first of all, its process is more complicated and the production cost is higher. At the same time, due to the addition of a reflective layer, the heat dissipation performance of the traditional LED light source module packaging structure is greatly reduced, and it is even more difficult to solve the heat dissipation problem of high-power LED light source modules

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