Processing method of silicon chip reworked after screen printing

Abstract

The invention relates to a processing method of a silicon chip reworked after screen printing. The method comprises the following steps: cleaning the silicon chip by adopting alcohol mixed with terpineol; then putting the silicon chip in hydrochloric acid with the mass percent concentration of 3-8% and immersing for 1-3 hours; then removing the residual hydrochloric acid on the surface of the silicon chip by utilizing de-ionized water; and finally putting the wetted silicon chip into alcohol for soaking and dehydration. By adopting the method provided by the invention, the problem of aluminum being residual on the surface of the silicon chip of the screen printing reworked chip in the treating process can be reduced, the generation of rejected products is reduced, and the solar conversion efficiency of the silicon chip is improved.

Description

technical field [0001] The invention relates to a processing method for reworked silicon wafers after screen printing. Background technique [0002] At present, the existing solar cells will produce a lot of reworked silicon wafers during the screen printing process. The traditional treatment method is manual cleaning with terpineol and alcohol, or ultrasonic cleaning with alcohol as a solvent. These two methods will make some aluminum paste Residues on the surface of the silicon wafer will eventually cause the dark current of the cell to be high and the open circuit voltage to be low, thereby reducing the pass rate and conversion efficiency of cell production. Contents of the invention [0003] The object of the present invention is to provide a treatment method for reworking silicon wafers after screen printing, which can reduce aluminum residues on the surface of silicon wafers, thereby improving the solar energy conversion efficiency of silicon wafers. [0004] The te...

AI Technical Summary

Problems solved by technology

[0002] At present, the existing solar cells will produce a lot of reworked silicon wafers during the screen printing process. The traditional treatment method is manual cleaning with terpineol and alcohol, or ultrasonic cleaning with alcohol as a solvent. These two methods will make some aluminum paste Residues on the surface of the silicon wafer will eventually cause the dark current of the cell to be high and the open circuit voltage to be low, thereby reducing the pass rate and conversion efficiency of cell production